Lei; Ryan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lei; Ryan.The latest application filed is for "germanium-on-insulator fabrication utilizing wafer bonding".

Company Profile

0.5.9

Lei; Ryan - Hillsboro OR
Lei; Ryan - Hillboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Germanium on insulator fabrication via epitaxial germanium bonding Grant 7,279,369 - Lei , et al. October 9, 2	2007-10-09
Integrating thermoelectric elements into wafer for heat extraction Grant 7,211,890 - Ramanathan , et al. May 1, 2	2007-05-01
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process Grant 7,161,224 - Tolchinsky , et al. January 9, 2	2007-01-09
Germanium-on-insulator fabrication utilizing wafer bonding App 20060049399 - Lei; Ryan ; et al.	2006-03-09
Germanium-on-insulator fabrication utilizing wafer bonding App 20060046488 - Lei; Ryan ; et al.	2006-03-02
Strained silicon with reduced roughness App 20050211982 - Lei, Ryan ; et al.	2005-09-29
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process App 20050173781 - Tolchinsky, Peter ; et al.	2005-08-11
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process Grant 6,908,027 - Tolchinsky , et al. June 21, 2	2005-06-21
Germanium-on-insulator fabrication utilizing wafer bonding App 20050067377 - Lei, Ryan ; et al.	2005-03-31
Integrating thermoelectric elements into wafer for heat extraction App 20050067692 - Ramanathan, Shriram ; et al.	2005-03-31
Germanium on insulator fabrication via epitaxial germanium bonding App 20050042842 - Lei, Ryan ; et al.	2005-02-24
Layer transfer technique App 20040262686 - Shaheen, Mohamad ; et al.	2004-12-30
Low temperature germanium transfer Grant 6,833,195 - Lei , et al. December 21, 2	2004-12-21
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process App 20040188501 - Tolchinsky, Peter ; et al.	2004-09-30

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