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Atomic layer deposition apparatus Grant 9,031,685 - Chin , et al. May 12, 2 | 2015-05-12 |
Atomic Layer Deposition Apparatus App 20140130739 - CHIN; Barry L. ;   et al. | 2014-05-15 |
Self aligning non contact shadow ring process kit Grant 8,342,119 - Yudovsky , et al. January 1, 2 | 2013-01-01 |
Multi-station deposition apparatus and method Grant 7,923,069 - Chang , et al. April 12, 2 | 2011-04-12 |
Multi-station Deposition Apparatus And Method App 20100316800 - Chang; Mei ;   et al. | 2010-12-16 |
Multi-station deposition apparatus and method Grant 7,794,789 - Chang , et al. September 14, 2 | 2010-09-14 |
Method and apparatus for measuring a thickness of a layer of a wafer Grant 7,777,483 - Lei , et al. August 17, 2 | 2010-08-17 |
Multi-station Deposition Apparatus And Method App 20090214786 - Chang; Mei ;   et al. | 2009-08-27 |
Multi-station deposition apparatus and method Grant 7,547,465 - Chang , et al. June 16, 2 | 2009-06-16 |
Method And Apparatus For Measuring Object Thickness App 20080186022 - Lei; Lawrence C. ;   et al. | 2008-08-07 |
Apparatus and method of dynamically measuring thickness of a layer of a substrate Grant 7,355,394 - Lei , et al. April 8, 2 | 2008-04-08 |
Self Aligning Non Contact Shadow Ring Process Kit App 20080072823 - Yudovsky; Joseph ;   et al. | 2008-03-27 |
Method and apparatus for measuring object thickness App 20070063698 - Lei; Lawrence C. ;   et al. | 2007-03-22 |
Method and apparatus for dynamically measuring the thickness of an object Grant 7,112,961 - Lei , et al. September 26, 2 | 2006-09-26 |
Multi-station deposition apparatus and method App 20050271814 - Chang, Mei ;   et al. | 2005-12-08 |
Multi-station deposition apparatus and method Grant 6,932,871 - Chang , et al. August 23, 2 | 2005-08-23 |
Clamshell and small volume chamber with fixed substrate support App 20050139160 - Lei, Lawrence C. ;   et al. | 2005-06-30 |
Clamshell and small volume chamber with fixed substrate support Grant 6,866,746 - Lei , et al. March 15, 2 | 2005-03-15 |
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition App 20040170403 - Lei, Lawrence C. | 2004-09-02 |
Method and apparatus for measuring object thickness App 20040140797 - Lei, Lawrence C. ;   et al. | 2004-07-22 |
Dual robot processing system Grant 6,729,824 - Lei , et al. May 4, 2 | 2004-05-04 |
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition Grant 6,718,126 - Lei April 6, 2 | 2004-04-06 |
Self aligning non contact shadow ring process kit App 20040003780 - Yudovsky, Joseph ;   et al. | 2004-01-08 |
Clamshell and small volume chamber with fixed substrate support App 20030221780 - Lei, Lawrence C. ;   et al. | 2003-12-04 |
Multi-station deposition apparatus and method App 20030194493 - Chang, Mei ;   et al. | 2003-10-16 |
Self aligning non contact shadow ring process kit Grant 6,589,352 - Yudovsky , et al. July 8, 2 | 2003-07-08 |
Dual robot processing system App 20030113187 - Lei, Lawrence C. ;   et al. | 2003-06-19 |
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition App 20030053799 - Lei, Lawrence C. | 2003-03-20 |
Chemical vapor deposition chamber App 20030019428 - Ku, Vincent W. ;   et al. | 2003-01-30 |
Apparatus for aligning a wafer Grant 6,436,192 - Chen , et al. August 20, 2 | 2002-08-20 |
Method and apparatus for preventing edge deposition Grant 6,375,748 - Yudovsky , et al. April 23, 2 | 2002-04-23 |
300 mm CVD chamber design for metal-organic thin film deposition Grant 6,364,949 - Or , et al. April 2, 2 | 2002-04-02 |
Apparatus And Method For Aligning A Wafer App 20010037771 - Chen, Ling ;   et al. | 2001-11-08 |
One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system Grant 6,302,964 - Umotoy , et al. October 16, 2 | 2001-10-16 |
Dual gas faceplate for a showerhead in a semiconductor wafer processing system Grant 6,086,677 - Umotoy , et al. July 11, 2 | 2000-07-11 |
Method for aligning a wafer Grant 6,063,440 - Chen , et al. May 16, 2 | 2000-05-16 |
Silicon scavenger in an inductively coupled RF plasma reactor Grant 5,556,501 - Collins , et al. September 17, 1 | 1996-09-17 |
Controlling edge deposition on semiconductor substrates Grant 5,556,476 - Lei , et al. September 17, 1 | 1996-09-17 |
Chemical vapor deposition chamber with a purge guide Grant 5,516,367 - Lei , et al. May 14, 1 | 1996-05-14 |
Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring Grant 5,476,548 - Lei , et al. December 19, 1 | 1995-12-19 |
Bottom purge manifold for CVD tungsten process Grant 5,468,298 - Lei , et al. November 21, 1 | 1995-11-21 |
Power loss recovery for wafer heater Grant 5,421,894 - Lei , et al. June 6, 1 | 1995-06-06 |
Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer Grant 5,213,650 - Wang , et al. May 25, 1 | 1993-05-25 |
Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer Grant 5,075,256 - Wang , et al. December 24, 1 | 1991-12-24 |
Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields Grant 4,714,536 - Freeman , et al. December 22, 1 | 1987-12-22 |