loadpatents
name:-0.036113977432251
name:-0.042125225067139
name:-0.0004270076751709
Lei; Lawrence C. Patent Filings

Lei; Lawrence C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lei; Lawrence C..The latest application filed is for "atomic layer deposition apparatus".

Company Profile
0.28.17
  • Lei; Lawrence C. - Milpitas CA
  • Lei; Lawrence C. - Cupertino CA
  • Lei; Lawrence C. - Mountain View CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Atomic layer deposition apparatus
Grant 9,031,685 - Chin , et al. May 12, 2
2015-05-12
Atomic Layer Deposition Apparatus
App 20140130739 - CHIN; Barry L. ;   et al.
2014-05-15
Self aligning non contact shadow ring process kit
Grant 8,342,119 - Yudovsky , et al. January 1, 2
2013-01-01
Multi-station deposition apparatus and method
Grant 7,923,069 - Chang , et al. April 12, 2
2011-04-12
Multi-station Deposition Apparatus And Method
App 20100316800 - Chang; Mei ;   et al.
2010-12-16
Multi-station deposition apparatus and method
Grant 7,794,789 - Chang , et al. September 14, 2
2010-09-14
Method and apparatus for measuring a thickness of a layer of a wafer
Grant 7,777,483 - Lei , et al. August 17, 2
2010-08-17
Multi-station Deposition Apparatus And Method
App 20090214786 - Chang; Mei ;   et al.
2009-08-27
Multi-station deposition apparatus and method
Grant 7,547,465 - Chang , et al. June 16, 2
2009-06-16
Method And Apparatus For Measuring Object Thickness
App 20080186022 - Lei; Lawrence C. ;   et al.
2008-08-07
Apparatus and method of dynamically measuring thickness of a layer of a substrate
Grant 7,355,394 - Lei , et al. April 8, 2
2008-04-08
Self Aligning Non Contact Shadow Ring Process Kit
App 20080072823 - Yudovsky; Joseph ;   et al.
2008-03-27
Method and apparatus for measuring object thickness
App 20070063698 - Lei; Lawrence C. ;   et al.
2007-03-22
Method and apparatus for dynamically measuring the thickness of an object
Grant 7,112,961 - Lei , et al. September 26, 2
2006-09-26
Multi-station deposition apparatus and method
App 20050271814 - Chang, Mei ;   et al.
2005-12-08
Multi-station deposition apparatus and method
Grant 6,932,871 - Chang , et al. August 23, 2
2005-08-23
Clamshell and small volume chamber with fixed substrate support
App 20050139160 - Lei, Lawrence C. ;   et al.
2005-06-30
Clamshell and small volume chamber with fixed substrate support
Grant 6,866,746 - Lei , et al. March 15, 2
2005-03-15
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
App 20040170403 - Lei, Lawrence C.
2004-09-02
Method and apparatus for measuring object thickness
App 20040140797 - Lei, Lawrence C. ;   et al.
2004-07-22
Dual robot processing system
Grant 6,729,824 - Lei , et al. May 4, 2
2004-05-04
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
Grant 6,718,126 - Lei April 6, 2
2004-04-06
Self aligning non contact shadow ring process kit
App 20040003780 - Yudovsky, Joseph ;   et al.
2004-01-08
Clamshell and small volume chamber with fixed substrate support
App 20030221780 - Lei, Lawrence C. ;   et al.
2003-12-04
Multi-station deposition apparatus and method
App 20030194493 - Chang, Mei ;   et al.
2003-10-16
Self aligning non contact shadow ring process kit
Grant 6,589,352 - Yudovsky , et al. July 8, 2
2003-07-08
Dual robot processing system
App 20030113187 - Lei, Lawrence C. ;   et al.
2003-06-19
Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition
App 20030053799 - Lei, Lawrence C.
2003-03-20
Chemical vapor deposition chamber
App 20030019428 - Ku, Vincent W. ;   et al.
2003-01-30
Apparatus for aligning a wafer
Grant 6,436,192 - Chen , et al. August 20, 2
2002-08-20
Method and apparatus for preventing edge deposition
Grant 6,375,748 - Yudovsky , et al. April 23, 2
2002-04-23
300 mm CVD chamber design for metal-organic thin film deposition
Grant 6,364,949 - Or , et al. April 2, 2
2002-04-02
Apparatus And Method For Aligning A Wafer
App 20010037771 - Chen, Ling ;   et al.
2001-11-08
One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system
Grant 6,302,964 - Umotoy , et al. October 16, 2
2001-10-16
Dual gas faceplate for a showerhead in a semiconductor wafer processing system
Grant 6,086,677 - Umotoy , et al. July 11, 2
2000-07-11
Method for aligning a wafer
Grant 6,063,440 - Chen , et al. May 16, 2
2000-05-16
Controlling edge deposition on semiconductor substrates
Grant 5,556,476 - Lei , et al. September 17, 1
1996-09-17
Silicon scavenger in an inductively coupled RF plasma reactor
Grant 5,556,501 - Collins , et al. September 17, 1
1996-09-17
Chemical vapor deposition chamber with a purge guide
Grant 5,516,367 - Lei , et al. May 14, 1
1996-05-14
Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring
Grant 5,476,548 - Lei , et al. December 19, 1
1995-12-19
Bottom purge manifold for CVD tungsten process
Grant 5,468,298 - Lei , et al. November 21, 1
1995-11-21
Power loss recovery for wafer heater
Grant 5,421,894 - Lei , et al. June 6, 1
1995-06-06
Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
Grant 5,213,650 - Wang , et al. May 25, 1
1993-05-25
Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer
Grant 5,075,256 - Wang , et al. December 24, 1
1991-12-24
Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
Grant 4,714,536 - Freeman , et al. December 22, 1
1987-12-22

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