Lei; Kuolung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lei; Kuolung.The latest application filed is for "water proofing and water detection schemes for mems-based environmental sensing devices".

Company Profile

6.11.6

Lei; Kuolung - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Water proofing and water detection schemes for MEMS-based environmental sensing devices Grant 11,305,984 - Vummidi Murali , et al. April 19, 2	2022-04-19
Water Proofing And Water Detection Schemes For Mems-based Environmental Sensing Devices App 20200223686 - VUMMIDI MURALI; Krishna Prasad ; et al.	2020-07-16
Water proofing and water detection schemes for MEMS-based environmental sensing devices Grant 10,640,367 - Vummidi Murali , et al.	2020-05-05
Non-contact temperature measurement sensor Grant 10,436,647 - Bhat , et al. O	2019-10-08
Non-contact Temperature Measurement Sensor App 20190101454 - Bhat; Jerome C. ; et al.	2019-04-04
Water Proofing And Water Detection Schemes For Mems-based Environmental Sensing Devices App 20190100428 - VUMMIDI MURALI; Krishna Prasad ; et al.	2019-04-04
Non-contact temperature measurement sensor Grant 10,113,915 - Bhat , et al. October 30, 2	2018-10-30
Methods of packaging microelectromechanical resonators Grant 8,426,233 - Lei , et al. April 23, 2	2013-04-23
Methods of forming packaged micro-electromechanical devices Grant 7,955,885 - Bhugra , et al. June 7, 2	2011-06-07
Methods of forming multi-chip semiconductor substrates Grant 7,871,857 - Lei , et al. January 18, 2	2011-01-18
Methods of forming microelectronic packaging substrates having through-substrate vias therein Grant 7,842,613 - Lei November 30, 2	2010-11-30
Flexible multi-chip module and method of making the same Grant 7,141,875 - Hsuan , et al. November 28, 2	2006-11-28
Flexible multi-chip module and method of making the same App 20050227412 - Hsuan, Min Chih ; et al.	2005-10-13
Flat-top bumping structure and preparation method Grant 6,784,089 - Lei , et al. August 31, 2	2004-08-31
Apparatus and method for bubble-free application of a resin to a substrate App 20040134420 - Lei, Kuolung	2004-07-15
Flat-top Bumping Structure And Preparation Method App 20040137707 - Lei, Kuolung ; et al.	2004-07-15

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