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LEI; Jian Patent Filings

LEI; Jian

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEI; Jian.The latest application filed is for "device and method for preparation of a composite for on-site pipeline reinforcement".

Company Profile
2.3.5
  • LEI; Jian - Chengdu CN
  • Lei; Jian - Sichuan CN
  • Lei; Jian - Beijing CN
  • Lei; Jian - Shenzhen CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device And Method For Preparation Of A Composite For On-site Pipeline Reinforcement
App 20220016806 - ZHANG; Yong ;   et al.
2022-01-20
Device and method for preparation of a composite for on-site pipeline reinforcement
Grant 11,179,867 - Zhang , et al. November 23, 2
2021-11-23
Data clearing method, apparatus and storage medium
Grant 10,810,172 - Lei , et al. October 20, 2
2020-10-20
Device And Method For Preparation Of A Composite For On-site Pipeline Reinforcement
App 20190134855 - ZHANG; Yong ;   et al.
2019-05-09
Method and system for recovering virtual network
Grant 10,038,593 - Wang , et al. July 31, 2
2018-07-31
Data Clearing Method, Apparatus And Storage Medium
App 20180046653 - LEI; Jian ;   et al.
2018-02-15
Method And System For Recovering Virtual Network
App 20160306710 - WANG; HUANGFENG ;   et al.
2016-10-20
Screen edge touch control optimization method, device and terminal
App 20160216840 - Lei; Jian
2016-07-28

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