Lei Cong

USPTO Trademark & Patent Filings

Lei Cong

Trademark applications and grants for Lei Cong. Lei Cong has 1 trademark applications. The latest application filed is for "TOPLINE TACKLE"

Company Profile
    Company Aliases
  • Cong Lei
  • cong lei
  • LEI; CONG - Huaian CN
  • LEI; CONG - Huai an CN
  • LEI; CONG - Shenzhen CN
  • Lei; Cong - Huaian CN
  • Lei; Cong - Huai an CN
  • Lei; Cong - Shenzhen CN

Trademarks Patents
Patent Applications
Patent ApplicationDate
METHOD FOR MAKING A HEAT DISSIPATION STRUCTURE
20200043827 - 16/596250 SHEN; FU-YUN ;   et al.
2020-02-06
RESIN COMPOSITION, ADHESIVE LAYER, AND CIRCUIT BOARD UTILIZING SAME
20190330500 - 16/021222 SHEN; FU-YUN ;   et al.
2019-10-31
METHOD FOR MANUFACTURING AN ULTRATHIN HEAT DISSIPATION STRUCTURE
20190320550 - 16/455971 HOU; NING ;   et al.
2019-10-17
HEAT DISSIPATION STRUCTURE, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME
20180082924 - 15/615065 SHEN; FU-YUN ;   et al.
2018-03-22
ULTRATHIN HEAT DISSIPATION STRUCTURE AND A METHOD FOR MANUFACTURING SAME
20170325356 - 15/191550 HOU; NING ;   et al.
2017-11-09
Method for making a heat dissipation structure
11,380,603 - 16/596,250 Shen , et al. July 5, 2
2022-07-05
Method for manufacturing an ultrathin heat dissipation structure
10,923,411 - 16/455,971 Hou , et al. February 16, 2
2021-02-16
Resin composition, adhesive layer, and circuit board utilizing same
10,745,595 - 16/021,222 Shen , et al. A
2020-08-18
Heat dissipation structure, method for making the same, and electronic device having the same
10,658,265 - 15/615,065 Shen , et al.
2020-05-19
Ultrathin heat dissipation structure
10,448,540 - 15/191,550 Hou , et al. Oc
2019-10-15
Patent Grants & Applications
Trademark Applications
Mark Image

Registration | Serial
Trademark
Application Date
 TOPLINE TACKLE
"TOPLINE TACKLE"
5127604 87049034
TOPLINE TACKLE
2016-05-25

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