Lei, Chon C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lei, Chon C..The latest application filed is for "method and structure for selective thermal paste deposition and retention on integrated circuit chip modules".

Company Profile

0.3.5

Lei, Chon C. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And Structure For Selective Thermal Paste Deposition And Retention On Integrated Circuit Chip Modules App 20050269716 - Lee, Tim H. ; et al.	2005-12-08
Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules Grant 6,965,171 - Lee , et al. November 15, 2	2005-11-15
Semi-aqueous solvent based method of cleaning rosin flux residue Grant 6,800,141 - Sachdev , et al. October 5, 2	2004-10-05
Method of removing silicone polymer deposits from electronic components Grant 6,652,665 - Sachdev , et al. November 25, 2	2003-11-25
Semi-aqueous solvent based method of cleaning rosin flux residue App 20030121529 - Sachdev, Krishna G. ; et al.	2003-07-03
Cleaning method to remove flux residue in electronic assembly App 20020094940 - Sachdev, Krishna G. ; et al.	2002-07-18
Low temperature solder column attach by injection molded solder and structure formed App 20020023945 - Gruber, Peter A. ; et al.	2002-02-28
Removal Of Cured Silicone Adhesive For Reworking Electronic Components App 20020000239 - SACHDEV, KRISHNA G. ; et al.	2002-01-03

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