Lehnert; Wolfgang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lehnert; Wolfgang.The latest application filed is for "method of manufacturing a semiconductor package, die, and die package".

Company Profile

12.37.44

Lehnert; Wolfgang - Lintach DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device Grant 11,424,201 - Rogalli , et al. August 23, 2	2022-08-23
Method Of Manufacturing A Semiconductor Package, Die, And Die Package App 20220230919 - CRAES; Fabian ; et al.	2022-07-21
Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate Grant 11,373,863 - Rupp , et al. June 28, 2	2022-06-28
Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package Grant 11,328,935 - Gatterbauer , et al. May 10, 2	2022-05-10
Chip Package And Method Of Forming A Chip Package App 20210375792 - SAX; Harry Walter ; et al.	2021-12-02
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a Support Layer and Methods for Forming a Plurality of Thin Wide Band Gap Semiconductor Wafers Using Support Layers App 20210351077 - Santos Rodriguez; Francisco Javier ; et al.	2021-11-11
Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers Grant 11,107,732 - Santos Rodriguez , et al. August 31, 2	2021-08-31
Methods For Processing A Semiconductor Substrate App 20210159115 - SCHUSTEREDER; Werner ; et al.	2021-05-27
Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device Grant 10,903,078 - Schulze , et al. January 26, 2	2021-01-26
Method Of Manufacturing A Template Wafer App 20210013090 - Lehnert; Wolfgang ; et al.	2021-01-14
Method of Manufacturing a Silicon Carbide Device and Wafer Composite Including Laser Modified Zones in a Handle Substrate App 20200357637 - Rupp; Roland ; et al.	2020-11-12
Wafer composite and method for producing a semiconductor component Grant 10,784,145 - Berger , et al. Sept	2020-09-22
Method of Forming a Layer Structure, Layer Structure, Method of Forming a Contact Structure, Method of Forming a Chip Package, a App 20200227278 - Gatterbauer; Johann ; et al.	2020-07-16
Wafer composite and method for producing semiconductor components Grant 10,651,072 - Berger , et al.	2020-05-12
Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbide Semiconductor Device App 20190362972 - Schulze; Hans-Joachim ; et al.	2019-11-28
Methods for Processing a Wide Band Gap Semiconductor Wafer, Methods for Forming a Plurality of Thin Wide Band Gap Semiconductor App 20190348328 - Santos Rodriguez; Francisco Javier ; et al.	2019-11-14
Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device Grant 10,431,504 - Lehnert , et al. O	2019-10-01
Wafer Composite and Method for Producing Semiconductor Components App 20190244850 - Berger; Rudolf ; et al.	2019-08-08
Wafer Composite and Method for Producing a Semiconductor Component App 20190244853 - Berger; Rudolf ; et al.	2019-08-08
Method of Forming an Aluminum Oxide Layer, Metal Surface with Aluminum Oxide Layer, and Electronic Device App 20180366427 - Rogalli; Michael ; et al.	2018-12-20
Semiconductor devices and processing methods Grant 10,103,123 - Rogalli , et al. October 16, 2	2018-10-16
Method for forming a semiconductor device and a semiconductor device Grant 10,020,226 - Rupp , et al. July 10, 2	2018-07-10
Method Of Manufacturing A Template Wafer App 20180047619 - Lehnert; Wolfgang ; et al.	2018-02-15
Capacitor and method of forming a capacitor Grant 9,881,991 - Lehnert , et al. January 30, 2	2018-01-30
Method for Forming a Semiconductor Device and a Semiconductor Device App 20170309517 - Rupp; Roland ; et al.	2017-10-26
Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure Grant 9,793,167 - Rupp , et al. October 17, 2	2017-10-17
Semiconductor Devices And Processing Methods App 20170236801 - Rogalli; Michael ; et al.	2017-08-17
Method for forming a semiconductor device and a semiconductor device Grant 9,704,750 - Rupp , et al. July 11, 2	2017-07-11
Two-dimensional material containing electronic components Grant 9,590,044 - Ruhl , et al. March 7, 2	2017-03-07
Capacitor having a top compressive polycrystalline plate Grant 9,583,559 - Lehnert , et al. February 28, 2	2017-02-28
Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core Grant 9,576,844 - Berger , et al. February 21, 2	2017-02-21
Method for Forming a Semiconductor Device and a Semiconductor Device App 20170033011 - Rupp; Roland ; et al.	2017-02-02
Method for Forming a Wafer Structure, a Method for Forming a Semiconductor Device and a Wafer Structure App 20170033010 - Rupp; Roland ; et al.	2017-02-02
Method of Manufacturing Semiconductor Devices by Bonding a Semiconductor Disk on a Base Substrate, Composite Wafer and Semiconductor Device App 20160260699 - Lehnert; Wolfgang ; et al.	2016-09-08
Composite Wafer Having a SiC-Based Functional Layer App 20160225856 - Berger; Rudolf ; et al.	2016-08-04
Method for providing a self-aligned pad protection in a semiconductor device Grant 9,385,031 - Rogalli , et al. July 5, 2	2016-07-05
Composite wafer for bonding and encapsulating an SiC-based functional layer Grant 9,349,804 - Berger , et al. May 24, 2	2016-05-24
Method for Producing a Semiconductor Device App 20160086842 - AHRENS; CARSTEN ; et al.	2016-03-24
Method for Manufacturing a Composite Wafer having a Graphite Core, and Composite Wafer having a Graphite Core App 20160086844 - Berger; Rudolf ; et al.	2016-03-24
Capacitor and Method of Forming a Capacitor App 20160043164 - Lehnert; Wolfgang ; et al.	2016-02-11
Method for manufacturing a composite wafer having a graphite core Grant 9,252,045 - Berger , et al. February 2, 2	2016-02-02
Method for producing a semiconductor device Grant 9,236,290 - Ahrens , et al. January 12, 2	2016-01-12
Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core Grant 9,224,633 - Berger , et al. December 29, 2	2015-12-29
Compound structure and method for forming a compound structure Grant 9,219,049 - Berger , et al. December 22, 2	2015-12-22
Method For Providing A Self-aligned Pad Protection In A Semiconductor Device App 20150357234 - Rogalli; Michael ; et al.	2015-12-10
Capacitor and method of forming a capacitor Grant 9,196,675 - Lehnert , et al. November 24, 2	2015-11-24
Method for forming a power semiconductor device Grant 9,171,728 - Mauder , et al. October 27, 2	2015-10-27
Method for providing a self-aligned pad protection in a semiconductor device Grant 9,165,821 - Rogalli , et al. October 20, 2	2015-10-20
Composite Wafer Having a Graphite Core App 20150279941 - Berger; Rudolf ; et al.	2015-10-01
Compressive Polycrystalline Silicon Film and Method of Manufacture Thereof App 20150194480 - Lehnert; Wolfgang ; et al.	2015-07-09
Methods For Processing A Semiconductor Device App 20150179507 - Rogalli; Michael ; et al.	2015-06-25
Compound Structure and Method for Forming a Compound Structure App 20150171045 - Berger; Rudolf ; et al.	2015-06-18
Compressive polycrystalline silicon film and method of manufacture thereof Grant 9,012,295 - Lehnert , et al. April 21, 2	2015-04-21
Method For Manufacturing A Composite Wafer Having A Graphite Core, And Composite Wafer Having A Graphite Core App 20140335676 - Berger; Rudolf ; et al.	2014-11-13
Two-dimensional Material Containing Electronic Components App 20140306184 - Ruhl; Guenther ; et al.	2014-10-16
Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core Grant 8,822,306 - Berger , et al. September 2, 2	2014-09-02
Method for Forming a Power Semiconductor Device App 20140235058 - Mauder; Anton ; et al.	2014-08-21
Composite Wafer and a Method for Manufacturing Same App 20140225125 - Berger; Rudolf ; et al.	2014-08-14
Power semiconductor device and a method for forming a semiconductor device Grant 8,786,012 - Mauder , et al. July 22, 2	2014-07-22
Capacitor and Method of Forming a Capacitor App 20140145305 - Lehnert; Wolfgang ; et al.	2014-05-29
Semiconductor Devices And Processing Methods App 20140110838 - Rogalli; Michael ; et al.	2014-04-24
Method of forming a capacitor Grant 8,685,828 - Lehnert , et al. April 1, 2	2014-04-01
Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core App 20140070232 - Berger; Rudolf ; et al.	2014-03-13
Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core Grant 8,404,562 - Berger , et al. March 26, 2	2013-03-26
Compressive Polycrystalline Silicon Film and Method of Manufacture Thereof App 20130043562 - Lehnert; Wolfgang ; et al.	2013-02-21
Compressive polycrystalline silicon film and method of manufacture thereof Grant 8,318,575 - Lehnert , et al. November 27, 2	2012-11-27
Method for Producing a Semiconductor Device App 20120289023 - Ahrens; Carsten ; et al.	2012-11-15
Power Semiconductor Device and a Method for Forming a Semiconductor Device App 20120286355 - Mauder; Anton ; et al.	2012-11-15
Compressive Polycrystalline Silicon Film and Method of Manufacture Thereof App 20120202327 - Lehnert; Wolfgang ; et al.	2012-08-09
Semiconductor Device and Method of Manufacturing Thereof App 20120181656 - Lehnert; Wolfgang ; et al.	2012-07-19
Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core App 20120083098 - Berger; Rudolf ; et al.	2012-04-05
Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core App 20120080690 - Berger; Rudolf ; et al.	2012-04-05
Method for producing a semiconductor including a foreign material layer Grant 7,947,569 - Mauder , et al. May 24, 2	2011-05-24
Method Of Making A Device Including A Capacitive Structure App 20100273307 - Sedlmaier; Stefan ; et al.	2010-10-28
Method For Producing A Semiconductor Including A Material Layer App 20090325361 - Mauder; Anton ; et al.	2009-12-31
Semiconductor Device and Method for Producing the Same App 20090122460 - Gschwandtner; Alexander ; et al.	2009-05-14

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