Lehner; Rudolf

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lehner; Rudolf.The latest application filed is for "method of manufacturing a template wafer".

Company Profile

3.12.17

Lehner; Rudolf - Laaber DE
Lehner; Rudolf - Trostberg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for processing semiconductor wafers using a grinding wheel Grant 10,974,365 - Lehner April 13, 2	2021-04-13
Method Of Manufacturing A Template Wafer App 20210013090 - Lehnert; Wolfgang ; et al.	2021-01-14
Method for Processing Semiconductor Wafers Using a Grinding Wheel App 20200298369 - Lehner; Rudolf	2020-09-24
Method for forming semiconductor devices Grant 10,710,210 - Lehner	2020-07-14
Method for Forming Semiconductor Devices App 20190275638 - Lehner; Rudolf	2019-09-12
Apparatus for controlling a movement of a grinding wheel, semiconductor wafer grinding system and method for forming semiconductor devices Grant 10,307,884 - Lehner	2019-06-04
Method Of Manufacturing A Template Wafer App 20180047619 - Lehnert; Wolfgang ; et al.	2018-02-15
Apparatus for Controlling a Movement of a Grinding Wheel, Semiconductor Wafer Grinding System and Method for Forming Semiconductor Devices App 20180021919 - Lehner; Rudolf	2018-01-25
Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure Grant 9,536,816 - Kessler , et al. January 3, 2	2017-01-03
Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure App 20160035658 - KESSLER; Angela ; et al.	2016-02-04
Unpolished Semiconductor Wafer and Method For Producing An Unpolished Semiconductor Wafer App 20100237474 - Hensel; Wolfgang ; et al.	2010-09-23
Unpolished semiconductor wafer and method for producing an unpolished semiconductor wafer Grant 7,754,009 - Hensel , et al. July 13, 2	2010-07-13
Radiofrequency power semiconductor module with cavity housing, and method for producing it Grant 7,417,198 - Betz , et al. August 26, 2	2008-08-26
Apparatus for singulating and bonding semiconductor chips, and method for the same Grant 7,259,088 - Lehner August 21, 2	2007-08-21
Configuration and method for contacting circuit structure Grant 7,245,026 - Lehner July 17, 2	2007-07-17
Unpolished semiconductor wafer and method for producing an unpolished semiconductor wafer App 20070072423 - Hensel; Wolfgang ; et al.	2007-03-29
Apparatus for singulating and bonding semiconductor chips, and method for the same App 20060065967 - Lehner; Rudolf	2006-03-30
High-frequency power semiconductor module with a hollow housing and method for the production thereof App 20060012016 - Betz; Bernd ; et al.	2006-01-19
Method for fabricating a semiconductor component with contacts situated at the underside App 20060014326 - Auburger; Albert ; et al.	2006-01-19
Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component Grant 6,906,428 - Lehner June 14, 2	2005-06-14
Apparatus for populating transport tapes Grant 6,895,731 - Lehner , et al. May 24, 2	2005-05-24
Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module Grant 6,867,492 - Auburger , et al. March 15, 2	2005-03-15
Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component App 20040089935 - Lehner, Rudolf	2004-05-13
Apparatus for populating transport tapes App 20040079055 - Lehner, Rudolf ; et al.	2004-04-29
Apparatus and method for populating transport tapes Grant 6,694,707 - Lehner , et al. February 24, 2	2004-02-24
Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module App 20030155661 - Auburger, Albert ; et al.	2003-08-21
Apparatus and method for populating transport tapes App 20030136087 - Lehner, Rudolf ; et al.	2003-07-24
Semiconductor component with contacts situated at the underside, and fabrication method App 20030015774 - Auburger, Albert ; et al.	2003-01-23
Configuration and method for the contacting of circuits App 20020173081 - Lehner, Rudolf	2002-11-21

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