Lehman; Lawrence P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lehman; Lawrence P..The latest application filed is for "structure to accommodate increase in volume expansion during solder reflow".

Company Profile

0.6.5

Lehman; Lawrence P. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method to accommodate increase in volume expansion during solder reflow Grant 7,703,199 - Caletka , et al. April 27, 2	2010-04-27
Structure to accommodate increase in volume expansion during solder reflow App 20060208030 - Caletka; David Vincent ; et al.	2006-09-21
Method of accommodating in volume expansion during solder reflow Grant 7,086,147 - Caletka , et al. August 8, 2	2006-08-08
Structure to accommodate increase in volume expansion during solder reflow App 20040183094 - Caletka, David Vincent ; et al.	2004-09-23
Structure to accommodate increase in volume expansion during solder reflow Grant 6,686,664 - Caletka , et al. February 3, 2	2004-02-03
Negative volume expansion lead-free electrical connection Grant 6,649,833 - Caletka , et al. November 18, 2	2003-11-18
Technique for imaging electrical contacts Grant 6,639,661 - Brodsky , et al. October 28, 2	2003-10-28
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing Grant 6,626,196 - Downes, Jr. , et al. September 30, 2	2003-09-30
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing App 20020189637 - Downes, Francis J. JR. ; et al.	2002-12-19
Structure to accommodate increase in volume expansion during solder reflow App 20020158110 - Caletka, David Vincent ; et al.	2002-10-31
Technique for imaging electrical contacts App 20020089663 - Brodsky, William L. ; et al.	2002-07-11

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