loadpatents
name:-0.010226011276245
name:-0.0092499256134033
name:-0.00057601928710938
Leenstra; Bouwe W. Patent Filings

Leenstra; Bouwe W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Leenstra; Bouwe W..The latest application filed is for "laser ablation system including variable energy beam to minimize etch-stop material damage".

Company Profile
0.8.6
  • Leenstra; Bouwe W. - Hopewell Junction NY US
  • Leenstra; Bouwe W. - Walden NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Vacuum transition for solder bump mold filling
Grant 9,498,837 - Garant , et al. November 22, 2
2016-11-22
Laser Ablation System Including Variable Energy Beam To Minimize Etch-stop Material Damage
App 20160184926 - Sheets; Courtney T. ;   et al.
2016-06-30
Fill head interface with combination vacuum pressure chamber
Grant 9,278,401 - Biggs , et al. March 8, 2
2016-03-08
Fill Head Interface With Combination Vacuum Pressure Chamber
App 20140224860 - Biggs; Glen N. ;   et al.
2014-08-14
Vacuum Transition For Solder Bump Mold Filling
App 20110049759 - Garant; John J. ;   et al.
2011-03-03
Method And Tool For Repositioning Solder Fill Head
App 20090242614 - BIGGS; GLEN N. ;   et al.
2009-10-01
Pressure-only molten metal valving apparatus and method
Grant 7,401,637 - Biggs , et al. July 22, 2
2008-07-22
Pressure-only molten metal valving apparatus and method
App 20080023526 - Biggs; Glen N. ;   et al.
2008-01-31
Process for forming a multi-level thin-film electronic packaging structure
Grant 6,678,949 - Prasad , et al. January 20, 2
2004-01-20
Process for forming a multi-level thin-film electronic packaging structure
App 20010037565 - Prasad, Chandrika ;   et al.
2001-11-08
Multi-level thin-film electronic packaging structure and related method
Grant 6,281,452 - Prasad , et al. August 28, 2
2001-08-28
Apparatus for providing solder interconnections to semiconductor and electronic packaging devices
Grant 6,099,935 - Brearley , et al. August 8, 2
2000-08-08
Laser ablation top surface reference chuck
Grant 5,905,566 - Comulada , et al. May 18, 1
1999-05-18

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