Lee; Yung Woo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Yung Woo.The latest application filed is for "semiconductor package and manufacturing method thereof".

Company Profile

3.10.14

Lee; Yung Woo - Anyang-si KR
Lee; Yung Woo - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package And Manufacturing Method Thereof App 20220051973 - Lee; Jae Ung ; et al.	2022-02-17
Semiconductor package and manufacturing method thereof Grant 11,152,296 - Lee , et al. October 19, 2	2021-10-19
Semiconductor Package And Manufacturing Method Thereof App 20210217725 - Kim; Jin Seong ; et al.	2021-07-15
Semiconductor Package Using A Polymer Substrate App 20210047172 - Lee; Yung Woo ; et al.	2021-02-18
Semiconductor package and manufacturing method thereof Grant 10,872,879 - Kim , et al. December 22, 2	2020-12-22
Semiconductor package using a polymer substrate Grant 10,822,226 - Lee , et al. November 3, 2	2020-11-03
Semiconductor package and manufacturing method thereof Grant 10,163,867 - Kim , et al. Dec	2018-12-25
Semiconductor Package And Manufacturing Method Thereof App 20180350734 - Lee; Jae Ung ; et al.	2018-12-06
Semiconductor package and manufacturing method thereof Grant 10,144,634 - Lee , et al. De	2018-12-04
Semiconductor Package And Manufacturing Method Thereof App 20180323170 - Kim; Jin Seong ; et al.	2018-11-08
Semiconductor package and manufacturing method thereof Grant 10,032,705 - Lee , et al. July 24, 2	2018-07-24
Semiconductor Device And Manufacturing Method Thereof App 20180134546 - Oh; Ji Hoon ; et al.	2018-05-17
Semiconductor Package And Manufacturing Method Thereof App 20180138155 - Kim; Jin Seong ; et al.	2018-05-17
Semiconductor package and manufacturing method thereof Grant 9,935,083 - Lee , et al. April 3, 2	2018-04-03
Semiconductor Package And Manufacturing Method Thereof App 20180057353 - Lee; Jae Ung ; et al.	2018-03-01
Semiconductor Package And Manufacturing Method Thereof App 20170320723 - Lee; Jae Ung ; et al.	2017-11-09
Semiconductor package and manufacturing method thereof Grant 9,809,446 - Lee , et al. November 7, 2	2017-11-07
Semiconductor Package And Manufacturing Method Thereof App 20170141081 - Lee; Jae Ung ; et al.	2017-05-18
Semiconductor Package And Manufacturing Method Thereof App 20170018493 - Lee; Jae Ung ; et al.	2017-01-19
Microfluidic sensor package structure and method Grant 9,513,254 - Jeon , et al. December 6, 2	2016-12-06
Semiconductor Package And Manufacturing Method Thereof App 20150274511 - Jung; Jong Dae ; et al.	2015-10-01
Semiconductor package and manufacturing method thereof Grant 9,056,765 - Jung , et al. June 16, 2	2015-06-16
Microfluidic Sensor Package Structure And Method App 20150041324 - Jeon; Hyung Il ; et al.	2015-02-12
Semiconductor Package And Manufacturing Method Thereof App 20140017843 - Jung; Jong Dae ; et al.	2014-01-16

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