Lee; Yung-Cheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Yung-Cheng.The latest application filed is for "single and multi-layer mesh structures for enhanced thermal transport".
- Lee; Yung-Cheng - Boulder CO
- Lee, Yung-Cheng - YunLin TW
| Patent | Date |
|---|---|
| Single And Multi-layer Mesh Structures For Enhanced Thermal Transport App 20220221233 - Yang; Ronggui ; et al. | 2022-07-14 |
| Thermal ground plane Grant 11,353,269 - Yang , et al. June 7, 2 | 2022-06-07 |
| Thermal Management Planes App 20220163268 - Lewis; Ryan J. ; et al. | 2022-05-26 |
| Polymer-based Microfabricated Thermal Ground Plane App 20220155025 - Lewis; Ryan John ; et al. | 2022-05-19 |
| Single and multi-layer mesh structures for enhanced thermal transport Grant 11,306,983 - Yang , et al. April 19, 2 | 2022-04-19 |
| Thermal Management Planes App 20220074673 - Lewis; Ryan J. ; et al. | 2022-03-10 |
| Folding Thermal Ground Plane App 20210400846 - Lewis; Ryan J. ; et al. | 2021-12-23 |
| Single And Multi-layer Mesh Structures For Enhanced Thermal Transport App 20210131753 - Yang; Ronggui ; et al. | 2021-05-06 |
| Micropillar-enabled Thermal Ground Plane App 20200300563 - Lewis; Ryan John ; et al. | 2020-09-24 |
| Micropillar-enabled thermal ground plane Grant 10,731,925 - Lewis , et al. | 2020-08-04 |
| Method and device for spreading high heat fluxes in thermal ground planes Grant 10,724,804 - Lewis , et al. | 2020-07-28 |
| Thermal Ground Plane App 20200191495 - Yang; Ronggui ; et al. | 2020-06-18 |
| Conformal Thermal Ground Planes App 20200149820 - Hulse; Michael ; et al. | 2020-05-14 |
| Thermal ground plane Grant 10,571,200 - Yang , et al. Feb | 2020-02-25 |
| Thermal ground plane Grant 10,527,358 - Yang , et al. J | 2020-01-07 |
| Polymer-based Microfabricated Thermal Ground Plane App 20190390919 - Lewis; Ryan John ; et al. | 2019-12-26 |
| Microfluidic Devices And Methods For Cellular Thermal Shift Assays App 20190358630 - Old; William ; et al. | 2019-11-28 |
| Mechanically Improved Microelectronic Thermal Interface Structure For Low Die Stress App 20190341328 - Milne; Jason G. ; et al. | 2019-11-07 |
| Conformal thermal ground planes Grant 10,458,716 - Hulse , et al. Oc | 2019-10-29 |
| Mechanically improved microelectronic thermal interface structure for low die stress Grant 10,446,466 - Milne , et al. Oc | 2019-10-15 |
| Thermal Management Planes App 20180320984 - Lewis; Ryan J. ; et al. | 2018-11-08 |
| Method And Device For Spreading High Heat Fluxes In Thermal Ground Planes App 20180128553 - Lewis; Ryan John ; et al. | 2018-05-10 |
| Method And Device For Optimization Of Vapor Transport In A Thermal Ground Plane Using Void Space In Mobile Systems App 20180106554 - LEWIS; RYAN JOHN ; et al. | 2018-04-19 |
| Polymer-based microfabricated thermal ground plane Grant 9,921,004 - Lewis , et al. March 20, 2 | 2018-03-20 |
| Flexible thermal ground plane and manufacturing the same Grant 9,909,814 - Yang , et al. March 6, 2 | 2018-03-06 |
| Thermal Ground Plane App 20170299277 - Yang; Ronggui ; et al. | 2017-10-19 |
| Flexible thermal ground plane and manufacturing the same Grant 9,651,312 - Yang , et al. May 16, 2 | 2017-05-16 |
| Thermal Ground Plane App 20170030654 - Yang; Ronggui ; et al. | 2017-02-02 |
| Flexible Thermal Ground Plane And Manufacturing The Same App 20160187070 - Yang; Ronggui ; et al. | 2016-06-30 |
| Polymer-based Microfabricated Thermal Ground Plane App 20160161193 - Lewis; Ryan John ; et al. | 2016-06-09 |
| Micropillar-enabled Thermal Ground Plane App 20160076820 - Lewis; Ryan John ; et al. | 2016-03-17 |
| Vacuum-enhanced Heat Spreader App 20160081227 - Lee; Yung-Cheng ; et al. | 2016-03-17 |
| Flexible thermal ground plane and manufacturing the same Grant 9,163,883 - Yang , et al. October 20, 2 | 2015-10-20 |
| Component Reachable Expandable Heat Plate App 20150129174 - Monson; Robert J. ; et al. | 2015-05-14 |
| Atomic layer deposition on micro-mechanical devices Grant 7,426,067 - Bright , et al. September 16, 2 | 2008-09-16 |
| High-security encoding device for remote controller App 20040052374 - Lee, Yung-Cheng ; et al. | 2004-03-18 |
| Article comprising a stacked array of electronic subassemblies Grant 5,049,982 - Lee , et al. September 17, 1 | 1991-09-17 |
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