Lee; Young Mo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Young Mo.The latest application filed is for "semiconductor package".

Company Profile

2.6.6

Lee; Young Mo - Seoul KR
Lee; Young Mo - Cheongju-si KR
Lee; Young-Mo - Kyoungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing hyaluronate film, and hyaluronate film manufactured thereby Grant 11,298,855 - Kweon , et al. April 12, 2	2022-04-12
Semiconductor package Grant 11,276,632 - Jung , et al. March 15, 2	2022-03-15
Semiconductor Package App 20200203265 - JUNG; Gi Jo ; et al.	2020-06-25
Method For Manufacturing Hyaluronate Film, And Hyaluronate Film Manufactured Thereby App 20200016795 - KWEON; Dong Keon ; et al.	2020-01-16
Polymer-hybrid carbon filler composite and method for preparing the same Grant 10,435,520 - Park , et al. O	2019-10-08
Polymer-hybrid Carbon Filler Composite And Method For Preparing The Same App 20190119454 - PARK; Jong Hyuk ; et al.	2019-04-25
Blank masks for extreme ultra violet lithography, methods of fabricating the same, and methods of correcting registration errors thereof Grant 9,335,625 - Lee , et al. May 10, 2	2016-05-10
Blank Masks For Extreme Ultra Violet Lithography, Methods Of Fabricating The Same, And Methods Of Correcting Registration Errors Thereof App 20150056541 - LEE; Young Mo ; et al.	2015-02-26
Blank masks for extreme ultra violet lithography, methods of fabricating the same, and methods of correcting registration errors thereof Grant 8,906,582 - Lee , et al. December 9, 2	2014-12-09
Blank Masks For Extreme Ultra Violet Lithography, Methods Of Fabricating The Same, And Methods Of Correcting Registration Errors Thereof App 20140030639 - LEE; Young Mo ; et al.	2014-01-30
Method for forming metal wire interconnection in semiconductor devices using dual damascene process Grant 6,764,944 - Lee , et al. July 20, 2	2004-07-20
Method for forming metal wire interconnection in semiconductor devices using dual damascene process App 20020058370 - Lee, Young-Mo ; et al.	2002-05-16

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