Lee; Yongduk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Yongduk.The latest application filed is for "stacked capacitive coupled resonant dual active bridge dc-dc converter".

Company Profile

4.9.15

Lee; Yongduk - Vernon CT
Lee; YongDuk - Gyeonggi-do KR
Lee; Yongduk - Paju-si KR
Lee; YongDuk - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked Capacitive Coupled Resonant Dual Active Bridge Dc-dc Converter App 20220294357 - Channegowda; Parikshith B. ; et al.	2022-09-15
Solid State Circuit Breaker App 20220200268 - Lee; Yongduk ; et al.	2022-06-23
Power conversion systems and methods Grant 11,218,086 - Liu , et al. January 4, 2	2022-01-04
Electrocaloric Heat Transfer System And Method Of Operating The Same App 20210372672 - Lee; Yongduk ; et al.	2021-12-02
Wireless Power Transformation For Rotating Propellers App 20210347465 - Choe; Jung Muk ; et al.	2021-11-11
Desaturation Circuit For Mosfet With High Noise Immunity And Fast Detection App 20210351770 - Liu; Bo ; et al.	2021-11-11
Power Conversion Systems And Methods App 20210297009 - Liu; Bo ; et al.	2021-09-23
Electrocaloric Heat Transfer System App 20210239368 - Lee; Yongduk ; et al.	2021-08-05
Drive Having Multilevel Inverter Modules App 20210135595 - Chen; Weilun Warren ; et al.	2021-05-06
Data driver circuit, display panel, and display device Grant 10,847,070 - Lee , et al. November 24, 2	2020-11-24
Ferroic Response Through Application Of Conjugate Field App 20200200443 - Mantese; Joseph V. ; et al.	2020-06-25
Data Driver Circuit, Display Panel, And Display Device App 20190340966 - LEE; YongDuk ; et al.	2019-11-07
Method of detecting data bit depth and interface device for display device using the same Grant 9,361,825 - Jeong , et al. June 7, 2	2016-06-07
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP App 20150325553 - Park; DongSam ; et al.	2015-11-12
Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP Grant 9,087,701 - Park , et al. July 21, 2	2015-07-21
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Grant 8,970,044 - Choi , et al. March 3, 2	2015-03-03
Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP Grant 8,883,561 - Park , et al. November 11, 2	2014-11-11
Method Of Detecting Data Bit Depth And Interface Device For Display Device Using The Same App 20140146058 - Jeong; Yangseok ; et al.	2014-05-29
Integrated Circuit Packaging System With Vertical Interconnects And Method Of Manufacture Thereof App 20120326325 - Choi; A Leam ; et al.	2012-12-27
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP App 20120273959 - Park; DongSam ; et al.	2012-11-01
Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Encapsulant with TMV for Vertical Interconnect in POP App 20120273960 - Park; DongSam ; et al.	2012-11-01

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