Lee; Yong Koon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Yong Koon.The latest application filed is for "semiconductor package".
- Lee; Yong Koon - Suwon-si KR
| Patent | Date |
|---|---|
| Semiconductor Package App 20220005793 - KANG; Myung Sam ; et al. | 2022-01-06 |
| Semiconductor Package And Antenna Module Comprising The Same App 20210313276 - LEE; Yong Koon ; et al. | 2021-10-07 |
| Semiconductor package and antenna module comprising the same Grant 11,062,999 - Lee , et al. July 13, 2 | 2021-07-13 |
| Semiconductor package and antenna module including the same Grant 11,037,880 - Kang , et al. June 15, 2 | 2021-06-15 |
| Antenna module Grant 10,903,548 - Lee , et al. January 26, 2 | 2021-01-26 |
| Semiconductor package and antenna module including the same Grant 10,896,884 - Lee , et al. January 19, 2 | 2021-01-19 |
| Semiconductor Package And Antenna Module Including The Same App 20200373244 - KANG; Myung Sam ; et al. | 2020-11-26 |
| Semiconductor package and antenna module including the same Grant 10,763,217 - Lee , et al. Sep | 2020-09-01 |
| Antenna Module App 20200185815 - Lee; Yong Koon ; et al. | 2020-06-11 |
| Semiconductor Package And Antenna Module Comprising The Same App 20200135654 - LEE; Yong Koon ; et al. | 2020-04-30 |
| Semiconductor Package And Antenna Module Including The Same App 20200066662 - LEE; Yong Koon ; et al. | 2020-02-27 |
| Semiconductor Package And Antenna Module Including The Same App 20200035607 - LEE; Yong Koon ; et al. | 2020-01-30 |
| Semiconductor Package App 20190378775 - LEE; Yong Koon ; et al. | 2019-12-12 |
| Fan-out semiconductor package module Grant 10,340,245 - Seol , et al. | 2019-07-02 |
| Semiconductor Package App 20190122994 - LEE; Yong Koon ; et al. | 2019-04-25 |
| Fan-out Semiconductor Package Module App 20180158791 - SEOL; Yong Jin ; et al. | 2018-06-07 |
| Fan-out semiconductor package module Grant 9,991,219 - Seol , et al. June 5, 2 | 2018-06-05 |
| Fan-out Semiconductor Package Module App 20180061801 - SEOL; Yong Jin ; et al. | 2018-03-01 |
| Fan-out semiconductor package and method of manufacturing same Grant 9,899,331 - Lee , et al. February 20, 2 | 2018-02-20 |
| Fan-out Semiconductor Package Module App 20170373035 - SEOL; Yong Jin ; et al. | 2017-12-28 |
| Fan-out Semiconductor Package And Method Of Manufacturing Same App 20170287839 - LEE; Yong Koon ; et al. | 2017-10-05 |
| Fan-out Semiconductor Package And Method Of Manufacturing Same App 20170287825 - LEE; Yong Koon ; et al. | 2017-10-05 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 