Lee; Yong Je

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Yong Je.The latest application filed is for "method and apparatus for providing video stream based on machine learning".

Company Profile

6.8.16

Lee; Yong Je - Seoul KR
Lee; Yong-Je - Cheonan-si KR
Lee; Yong-Je - Hwaseong-si KR
Lee; Yong Je - Hawseong-si KR
LEE; YONG JE - HAWSEONG-S1 KR
Lee; Yong Je - Suwon-si KR
Lee; Yong-Je - Asan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and Apparatus for Providing Video Stream Based on Machine Learning App 20220303621 - Ahn; Sang Il ; et al.	2022-09-22
Apparatus And Method For Generating And Validating Customized Investment Portfolios App 20210256611 - PARK; Joo Sung ; et al.	2021-08-19
Terminal, Operating Method Thereof, And Computer-readable Recording Medium App 20210243408 - Ahn; Sang Il ; et al.	2021-08-05
Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package Grant 10,784,244 - Han , et al. Sept	2020-09-22
Method of manufacturing multi-chip package Grant 10,679,972 - Han , et al.	2020-06-09
Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire Grant 10,658,326 - Han , et al.	2020-05-19
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20190259742 - Han; Won-Gil ; et al.	2019-08-22
Semiconductor Devices Having Wire Bonding Structures And Methods Of Fabricating The Same App 20190157237 - LEE; Yong Je ; et al.	2019-05-23
Method Of Manufacturing Multi-chip Package App 20190103381 - HAN; Won-Gil ; et al.	2019-04-04
Multi-chip package and method of manufacturing the same Grant 10,147,706 - Han , et al. De	2018-12-04
Multi-chip Package And Method Of Manufacturing The Same App 20180114776 - HAN; Won-Gil ; et al.	2018-04-26
Bonding Wire, Wire Bonding Method Using The Bonding Wire, And Electrical Connection Part Of Semiconductor Device Using The Bonding Wire App 20180026004 - HAN; WON-GIL ; et al.	2018-01-25
Multi-bus system Grant 9,652,422 - Lee , et al. May 16, 2	2017-05-16
Bus protocol checker, system on chip including the same, bus protocol checking method Grant 9,442,788 - Woo , et al. September 13, 2	2016-09-13
Multi-chip package and method of manufacturing the same Grant 9,252,123 - Han , et al. February 2, 2	2016-02-02
Multi-chip Package And Method Of Manufacturing The Same App 20150031149 - HAN; Won-Gil ; et al.	2015-01-29
Bus Protocol Checker, System On Chip Including The Same, Bus Protocol Checking Method App 20140281759 - WOO; DEUM-JI ; et al.	2014-09-18
Multi-bus System App 20140215116 - LEE; YONG JE ; et al.	2014-07-31
Multi-chip Package And Method Of Manufacturing The Same App 20130093080 - HAN; Won-Gil ; et al.	2013-04-18
Wire bonding apparatus and method using the same Grant 8,245,902 - Lee , et al. August 21, 2	2012-08-21
Wire Bonding Apparatus And Method Using The Same App 20120111923 - Lee; Yong-Je ; et al.	2012-05-10
Multi-chip Packages App 20120056178 - Han; Won-Gil ; et al.	2012-03-08

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