Lee; Yeu Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Yeu Wen.The latest application filed is for "semiconductor component and method of manufacture".

Company Profile

0.6.5

Lee; Yeu Wen - Negeri Sembilan N/A MY
Lee; Yeu Wen - Seremban MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor component and method of manufacture Grant 8,461,670 - Celaya , et al. June 11, 2	2013-06-11
Semiconductor Component And Method Of Manufacture App 20110298115 - Celaya; Phillip ; et al.	2011-12-08
Semiconductor package structure having enhanced thermal dissipation characteristics Grant 7,755,179 - Carney , et al. July 13, 2	2010-07-13
Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics App 20080246130 - Carney; Francis J. ; et al.	2008-10-09
Semiconductor package and leadframe therefor having angled corners Grant 7,247,931 - Ng , et al. July 24, 2	2007-07-24
Method for making a direct chip attach device and structure Grant 7,144,538 - Lee , et al. December 5, 2	2006-12-05
Method of forming a semiconductor package and leadframe therefor App 20060263940 - Ng; Chuan Kiak ; et al.	2006-11-23
Method of forming a leadframe for a semiconductor package Grant 7,105,378 - Ng , et al. September 12, 2	2006-09-12
Method of forming a semiconductor package and leadframe therefor App 20050179118 - Ng, Chuan Kiak ; et al.	2005-08-18
Method for making a direct chip attach device and structure App 20040262811 - Lee, Yeu Wen ; et al.	2004-12-30

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