Lee; Yee Kim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Yee Kim.The latest application filed is for "delamination resistant device package having raised bond surface and mold locking aperture".
- Lee; Yee Kim - Segamat N/A MY
- Lee; Yee Kim - Johor MY
- Lee; Yee Kim - Jahor MY
| Patent | Date |
|---|---|
| Delamination resistant device package having raised bond surface and mold locking aperture Grant 8,736,042 - Li , et al. May 27, 2 | 2014-05-27 |
| Delamination Resistant Device Package Having Raised Bond Surface And Mold Locking Aperture App 20120080781 - LI; Felix C. ; et al. | 2012-04-05 |
| Delamination resistant device package having low moisture sensitivity Grant 8,097,934 - Li , et al. January 17, 2 | 2012-01-17 |
| Leadframe packages having enhanced ground-bond reliability Grant 8,093,707 - Lee , et al. January 10, 2 | 2012-01-10 |
| Dap Ground Bond Enhancement App 20110140253 - LEE; Shaw Wei ; et al. | 2011-06-16 |
| Leadframe Packages Having Enhanced Ground-bond Reliability App 20110089556 - LEE; Shaw Wei ; et al. | 2011-04-21 |
| TO263 device package having low moisture sensitivity Grant 7,838,980 - Lee , et al. November 23, 2 | 2010-11-23 |
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