Lee; Yao-Jung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Yao-Jung.The latest application filed is for "microphone package structure and method for fabricating the same".
- Lee; Yao-Jung - Rende Township N/A TW
- Lee; Yao-Jung - Tainan County TW
- Lee; Yao-Jung - Tainan TW
- Lee; Yao-Jung - Rende Shiang TW
| Patent | Date |
|---|---|
| Capacitive transducer and fabrication method Grant 8,693,711 - Ho , et al. April 8, 2 | 2014-04-08 |
| Microphone Package Structure And Method For Fabricating The Same App 20120146163 - Ho; Tzong-Che ; et al. | 2012-06-14 |
| Capacitive Transducer And Fabrication Method App 20110150261 - HO; Tzong-Che ; et al. | 2011-06-23 |
| Film type package for fingerprint sensor Grant 7,936,032 - Huang , et al. May 3, 2 | 2011-05-03 |
| Film type package for fingerprint sensor Grant 7,812,422 - Huang , et al. October 12, 2 | 2010-10-12 |
| Electronic device with a warped spring connector Grant 7,696,443 - Lee , et al. April 13, 2 | 2010-04-13 |
| Image sensor assembly and method for fabricating the same Grant 7,420,267 - Chao , et al. September 2, 2 | 2008-09-02 |
| Flim type package for fingerprint sensor App 20080187191 - Huang; Ming-Liang ; et al. | 2008-08-07 |
| Multi-chip image sensor module Grant 7,372,135 - Chao , et al. May 13, 2 | 2008-05-13 |
| Modular probe card Grant 7,372,286 - Lee , et al. May 13, 2 | 2008-05-13 |
| Flim type package for fingerprint sensor App 20080085038 - Huang; Ming-Liang ; et al. | 2008-04-10 |
| Probe head with vertical probes, method for manufacturing the probe head and probe card using the probe head App 20070222465 - Huang; Hsiang-Ming ; et al. | 2007-09-27 |
| Package structure of image sensor device App 20070152148 - Chao; Yeong-Ching ; et al. | 2007-07-05 |
| Modular probe card App 20070152689 - Lee; Yi-Chang ; et al. | 2007-07-05 |
| Replaceable modular probe head App 20070085554 - Huang; Hsiang-Ming ; et al. | 2007-04-19 |
| Method for fabricating anisotropic conductive substrate Grant 7,140,101 - Cheng , et al. November 28, 2 | 2006-11-28 |
| Probe card assembly Grant 7,129,730 - Liu , et al. October 31, 2 | 2006-10-31 |
| Image sensor module package App 20060231750 - Chao; Yeong-Ching ; et al. | 2006-10-19 |
| Modularized probe card for high frequency probing Grant 7,088,118 - Liu , et al. August 8, 2 | 2006-08-08 |
| Modularized Probe Card For High Frequency Probing App 20060125498 - Liu; An-Hong ; et al. | 2006-06-15 |
| Modularized probe head App 20060125501 - Liu; An-Hong ; et al. | 2006-06-15 |
| Probe card interposer App 20060091510 - Liu; An-Hong ; et al. | 2006-05-04 |
| Image sensor assembly and method for fabricating the same App 20060087022 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Multi-chip image sensor module App 20060087018 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Package structure of image sensor device App 20060086890 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Structure of image sensor package App 20060086899 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Image sensor package App 20060087017 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Electronic device with a warped spring connector App 20060042834 - Lee; Yi-Chang ; et al. | 2006-03-02 |
| Bump structure of an opto-electronic chip App 20060043538 - Lee; Yi-Chang ; et al. | 2006-03-02 |
| Chip-under-tape package structure and manufacture thereof App 20060022317 - Liu; An-Hong ; et al. | 2006-02-02 |
| Modularized probe head Grant 6,946,860 - Cheng , et al. September 20, 2 | 2005-09-20 |
| Probe card assembly Grant 6,853,205 - Cheng , et al. February 8, 2 | 2005-02-08 |
| Probe Card Assembly App 20050012513 - Cheng, Shih-Jye ; et al. | 2005-01-20 |
| Modularized probe card with coaxial transmitters Grant 6,812,720 - Cheng , et al. November 2, 2 | 2004-11-02 |
| Modularized probe card with compressible electrical connection device Grant 6,781,392 - Cheng , et al. August 24, 2 | 2004-08-24 |
| Substrate-on-chip packaging process Grant 6,689,638 - Lin , et al. February 10, 2 | 2004-02-10 |
| Modular probe card assembly Grant 6,621,710 - Cheng , et al. September 16, 2 | 2003-09-16 |
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