loadpatents
Patent applications and USPTO patent grants for Lee; Wu Hsiang.The latest application filed is for "memory module structure".
Patent | Date |
---|---|
Memory module structure Grant 6,642,554 - Yeh , et al. November 4, 2 | 2003-11-04 |
Stacked package structure of image sensor Grant 6,627,983 - Tu , et al. September 30, 2 | 2003-09-30 |
Memory module structure App 20030094628 - Yeh, Nai Hua ;   et al. | 2003-05-22 |
Integrated circuit structure having an adhesive agent and method for manufacturing the same App 20020096751 - Chen, Wen Chuan ;   et al. | 2002-07-25 |
Stacked package structure of image sensor App 20020096753 - Tu, Hsiu Wen ;   et al. | 2002-07-25 |
Stacked package structure of image sensor App 20020096729 - Tu, Hsiu Wen ;   et al. | 2002-07-25 |
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