Lee; Woong Sun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Woong Sun.The latest application filed is for "semiconductor chip module and semiconductor package having the same".

Company Profile

1.17.17

Lee; Woong Sun - Suwon-si N/A KR
LEE; Woong Sun - Suwon-si Gyeonggi-do KR
Lee; Woong Sun - Gyeonggi-do KR
Lee; Woong-Sun - Daejeon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stack type semiconductor package Grant 8,796,834 - Bae , et al. August 5, 2	2014-08-05
Semiconductor Chip Module And Semiconductor Package Having The Same App 20140014958 - OH; Tac Keun ; et al.	2014-01-16
Semiconductor package using through-electrodes having voids Grant 8,618,637 - Bae , et al. December 31, 2	2013-12-31
Stack package and method for manufacturing the same Grant 8,558,380 - Kim , et al. October 15, 2	2013-10-15
Method Of Fabricating Semiconductor Package App 20130236993 - LEE; Woong Sun ; et al.	2013-09-12
Method of fabricating semiconductor package Grant 8,445,322 - Lee , et al. May 21, 2	2013-05-21
Semiconductor package having substrate for high speed semiconductor package Grant 8,441,116 - Lee , et al. May 14, 2	2013-05-14
Semiconductor package requiring reduced manufacturing processes Grant 8,399,998 - Kim , et al. March 19, 2	2013-03-19
Substrate For Semiconductor Package Having Coating Film And Method For Manufacturing The Same App 20130029458 - LEE; Woong Sun	2013-01-31
Substrate For High Speed Semiconductor Package And Semiconductor Package Having The Same App 20120217637 - LEE; Woong Sun ; et al.	2012-08-30
Semiconductor Package And Method For Manufacturing The Same App 20120205798 - KIM; Si Han ; et al.	2012-08-16
Circuit board having semiconductor chip Grant 8,129,627 - Lee , et al. March 6, 2	2012-03-06
Stacked Semiconductor Package And Method For Fabricating The Same App 20120015477 - LEE; Woong Sun ; et al.	2012-01-19
Stack Package App 20110309504 - BAE; Jin Ho ; et al.	2011-12-22
Stacked semiconductor package and method for fabricating the same Grant 8,053,879 - Lee , et al. November 8, 2	2011-11-08
Semiconductor Package Requiring Reduced Manufacturing Processes App 20110031604 - KIM; Ki Young ; et al.	2011-02-10
3-dimensional substrate for embodying multi-packages and method of fabricating the same Grant 7,880,093 - Lee February 1, 2	2011-02-01
Circuit Board Having Semiconductor Chip App 20100326715 - LEE; Woong Sun ; et al.	2010-12-30
Flip chip package and method for manufacturing the same Grant 7,859,108 - Lee , et al. December 28, 2	2010-12-28
Copper-clad Laminate With Capacitor, Printed Circuit Board Having The Same, And Semiconductor Package Having The Printed Circuit Board App 20100142118 - LEE; Woong Sun	2010-06-10
Stacked Semiconductor Package And Method For Fabricating The Same App 20100052187 - LEE; Woong Sun ; et al.	2010-03-04
Semiconductor Package Using Through-electrodes Having Voids App 20090321892 - BAE; Han Jun ; et al.	2009-12-31
Substrate For Semiconductor Package Having Coating Film And Method For Manufacturing The Same App 20090174073 - LEE; Woong Sun	2009-07-09
Substrate For High Speed Semiconductor Package And Semiconductor Package Having The Same App 20090152708 - LEE; Woong Sun ; et al.	2009-06-18
Flip Chip Package And Method For Manufacturing The Same App 20090140426 - LEE; Woong Sun ; et al.	2009-06-04
Method of bonding solder pads of flip-chip package Grant 7,387,910 - Lee , et al. June 17, 2	2008-06-17
3-dimensional Substrate For Embodying Multi-packages And Method Of Fabricating The Same App 20080081209 - Lee; Woong Sun	2008-04-03
Method of bonding solder pads of flip-chip package App 20060258049 - Lee; Woong-Sun ; et al.	2006-11-16

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