Lee; Won Hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Won Hwa.The latest application filed is for "fusion polypeptide in which anti-inflammatory polypeptide and ferritin monomer fragment are bound and pharmaceutical composition for preventing and treating inflammatory diseases, containing same as active ingredient".

Company Profile

2.5.7

Lee; Won Hwa - Changwon-si KR
Lee; Won-hwa - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fusion polypeptide in which anti-inflammatory polypeptide and ferritin monomer fragment are bound and pharmaceutical composition for preventing and treating inflammatory diseases, containing same as active ingredient Grant 10,513,545 - Bae , et al. Dec	2019-12-24
Fusion Polypeptide In Which Anti-inflammatory Polypeptide And Ferritin Monomer Fragment Are Bound And Pharmaceutical Composition For Preventing And Treating Inflammatory Diseases, Containing Same As Active Ingredient App 20190016764 - BAE; Jong-Sup ; et al.	2019-01-17
Secondary memory device Grant 9,684,345 - Choi , et al. June 20, 2	2017-06-20
Semiconductor module Grant 9,437,518 - Byun , et al. September 6, 2	2016-09-06
Secondary Memory Device App 20140146461 - Choi; Jin-young ; et al.	2014-05-29
Semiconductor Module App 20140117528 - BYUN; Jaebum ; et al.	2014-05-01
Stacked Package And Method Of Manufacturing The Same App 20130122653 - LEE; Won-Hwa ; et al.	2013-05-16
Stacked package and method of manufacturing the same Grant 8,349,651 - Lee , et al. January 8, 2	2013-01-08
Stacked Package And Method Of Manufacturing The Same App 20110312130 - Lee; Won-Hwa ; et al.	2011-12-22
Stacked package and method of manufacturing the same Grant 8,030,747 - Lee , et al. October 4, 2	2011-10-04
Stacked package and method of manufacturing the same App 20090108425 - Lee; Won-Hwa ; et al.	2009-04-30

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