Lee; William T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; William T..The latest application filed is for "interlevel conductor pre-fill utilizing selective barrier deposition".

Company Profile

1.18.7

Lee; William T. - Dublin CA
Lee; William T. - Pleasanton CA
Lee; William T. - San Jose CA
Lee; William T. - Syracuse NY
Lee; William T. - Canoga Park CA
Lee; William T. - Harvey LA
Lee; William T. - Houston TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 10,262,943 - Kolics , et al.	2019-04-16
Integrated direct dielectric and metal deposition Grant 10,128,116 - Lee , et al. November 13, 2	2018-11-13
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20180151503 - Kolics; Artur ; et al.	2018-05-31
Integrated Direct Dielectric And Metal Deposition App 20180108529 - Lee; William T. ; et al.	2018-04-19
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 9,875,968 - Kolics , et al. January 23, 2	2018-01-23
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20170162512 - Kolics; Artur ; et al.	2017-06-08
Interlevel conductor pre-fill utilizing selective barrier deposition Grant 9,583,386 - Kolics , et al. February 28, 2	2017-02-28
Selective formation of dielectric barriers for metal interconnects in semiconductor devices Grant 9,418,889 - Mountsier , et al. August 16, 2	2016-08-16
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition App 20160118296 - Kolics; Artur ; et al.	2016-04-28
Selective Formation Of Dielectric Barriers For Metal Interconnects In Semiconductor Devices App 20150380302 - Mountsier; Thomas Weller ; et al.	2015-12-31
Plated metal hard mask for vertical NAND hole etch Grant 9,184,060 - Lee November 10, 2	2015-11-10
Devices for metallization Grant 9,006,893 - Kolics , et al. April 14, 2	2015-04-14
Electroless copper deposition with suppressor Grant 8,828,863 - Lee , et al. September 9, 2	2014-09-09
Interconnect with self-formed barrier Grant 8,673,779 - Yoon , et al. March 18, 2	2014-03-18
Methods, Devices, And Materials For Metallization App 20140054776 - KOLICS; Artur ; et al.	2014-02-27
Methods, devices, and materials for metallization Grant 8,518,815 - Kolics , et al. August 27, 2	2013-08-27
Methods, Devices, And Materials For Metallization App 20120007239 - Kolics; Artur ; et al.	2012-01-12
Modular substrate processing system Grant 6,235,634 - White , et al. May 22, 2	2001-05-22
Optimal probe point placement Grant 5,675,499 - Lee , et al. October 7, 1	1997-10-07
Method of probing a net of an IC at an optimal probe-point Grant 5,530,372 - Lee , et al. June 25, 1	1996-06-25
Cloned Leuconostoc mesenteroides glucose-6-phosphate dehydrogenase genes and method of making glucose-6-phospate dehydrogenase Grant 5,244,796 - Levy , et al. September 14, 1	1993-09-14
Heat enhancers and salt purifiers for thermal energy storage canister Grant 4,830,092 - Lee May 16, 1	1989-05-16
Cementing head Grant 3,971,436 - Lee July 27, 1	1976-07-27
Lock Ring Assembly For Locking Threaded Shouldered Joints Grant 3,608,933 - Lee September 28, 1	1971-09-28

Company Registrations

NCAGE Code	4K0M7	LEE WILLIAM T
CAGE Code	4K0M7	LEE, WILLIAM T
DUNS	785152013	LEE, WILLIAM T

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