LEE; Wen-Long

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Wen-Long.The latest application filed is for "method of using high density plasma chemical vapor deposition chamber".

Company Profile

1.15.17

LEE; Wen-Long - Hsinchu TW
LEE; Wen-Long - Hsinchu City TW
Lee; Wen-Long - Taipei TW
Lee; Wen-Long - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Using High Density Plasma Chemical Vapor Deposition Chamber App 20220270855 - WU; Wei-Ching ; et al.	2022-08-25
High density plasma chemical vapor deposition chamber and method of using Grant 11,342,164 - Wu , et al. May 24, 2	2022-05-24
High Density Plasma Chemical Vapor Deposition Chamber And Method Of Using App 20210125811 - WU; Wei-Ching ; et al.	2021-04-29
Method of controlling an adjustable nozzle and method of making a semiconductor device Grant 10,910,199 - Wu , et al. February 2, 2	2021-02-02
Method Of Controlling An Adjustable Nozzle And Method Of Making A Semiconductor Device App 20180226224 - WU; Wei-Ching ; et al.	2018-08-09
Adjustable nozzle for plasma deposition and a method of controlling the adjustable nozzle Grant 9,941,100 - Wu , et al. April 10, 2	2018-04-10
Substrate heat treatment apparatus and heat treatment method Grant 9,859,137 - Kuo , et al. January 2, 2	2018-01-02
Interlayer dielectric structure with high aspect ratio process (HARP) Grant 9,716,044 - Chang , et al. July 25, 2	2017-07-25
Gate structure having spacer with flat top surface and method for forming the same Grant 9,349,733 - Chang , et al. May 24, 2	2016-05-24
Gate Structure Having Spacer With Flat Top Surface And Method For Forming The Same App 20150380406 - CHANG; Jen-Chi ; et al.	2015-12-31
Substrate Heat Treatment Apparatus And Heat Treatment Method App 20150348847 - KUO; Chun-Cha ; et al.	2015-12-03
Profile pre-shaping for replacement poly gate interlayer dielectric Grant 9,048,185 - Chiang , et al. June 2, 2	2015-06-02
Profile Pre-shaping For Replacement Poly Gate Interlayer Dielectric App 20140349471 - Chiang; Chih-Wei ; et al.	2014-11-27
Profile pre-shaping for replacement poly gate interlayer dielectric Grant 8,803,249 - Chiang , et al. August 12, 2	2014-08-12
Profile Pre-shaping For Replacement Poly Gate Interlayer Dielectric App 20140042553 - Chiang; Chih-Wei ; et al.	2014-02-13
Adjustable Nozzle For Plasma Deposition And A Method Of Controlling The Adjustable Nozzle App 20130156940 - WU; Wei-Ching ; et al.	2013-06-20
Interlayer Dielectric Structure And Method Making The Same App 20130043539 - Chang; Jen-Chi ; et al.	2013-02-21
Low temperature method for minimizing copper hillock defects Grant 7,851,358 - Wu , et al. December 14, 2	2010-12-14
Method of smoothening dielectric layer Grant 7,635,651 - Lee , et al. December 22, 2	2009-12-22
Methods of spin-on wafer cleaning Grant 7,611,589 - Wu , et al. November 3, 2	2009-11-03
Hillock reduction in copper films Grant 7,368,383 - Lin , et al. May 6, 2	2008-05-06
Hillock reduction in copper films App 20060270227 - Lin; Shih-Chi ; et al.	2006-11-30
Low temperature method for minimizing copper hillock defects App 20060252258 - Wu; Jun ; et al.	2006-11-09
Methods of spin-on wafer cleaning App 20060196526 - Wu; Jun ; et al.	2006-09-07
Method of smoothening dielectric layer App 20060189149 - Lee; Wen-Long ; et al.	2006-08-24
Semiconductor Wafer Cleaning Method To Remove Residual Contamination Including Metal Nitride Particles App 20030084919 - Tai, Yali ; et al.	2003-05-08

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