LEE; Wen-Hsi

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Wen-Hsi.The latest application filed is for "method of forming semiconductor device including trimmed-gates".

Company Profile

7.15.23

LEE; Wen-Hsi - Hsinchu TW
Lee; Wen-Hsi - Kaohsiung TW
LEE; Wen-Hsi - Kaohsiung City TW
Lee; Wen-Hsi - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Forming Semiconductor Device Including Trimmed-gates App 20210305261 - CHEN; Yu-Jen ; et al.	2021-09-30
Semiconductor device including trimmed-gates Grant 11,037,935 - Chen , et al. June 15, 2	2021-06-15
Block layer in the metal gate of MOS devices Grant 10,840,330 - Tsao , et al. November 17, 2	2020-11-17
Thick-Film Aluminum Electrode Paste with Pretreatment before Metal Plating for Fabricating Chip Resistor App 20190392968 - Lee; Wen-Hsi	2019-12-26
Semiconductor Device Including Trimmed-gates App 20190341389 - CHEN; Yu-Jen ; et al.	2019-11-07
Semiconductor device including trimmed-gates and method for generating layout of same Grant 10,373,962 - Chen , et al.	2019-08-06
Pretreatment of Thick-Film Aluminum Electrode for Metal Plating App 20190189312 - Lee; Wen-Hsi	2019-06-20
Methods of Fabricating Conductive Thick-Film Pastes of Base Metals with High Conductivity Achieved App 20190143405 - Lee; Wen-Hsi	2019-05-16
Methods of fabricating chip resistors using aluminum terminal electrodes Grant 10,290,403 - Lee	2019-05-14
Fabrication method of magnetic device Grant 10,259,172 - Huang , et al.	2019-04-16
Method of fabricating high-conductivity thick-film aluminum paste Grant 10,174,210 - Lee J	2019-01-08
Semiconductor Device Including Trimmed-gates And Method For Generating Layout Of Same App 20180342523 - CHEN; Yu-Jen ; et al.	2018-11-29
Methods of Fabricating Chip Resistors Using Aluminum Terminal Electrodes App 20180174720 - Lee; Wen-Hsi	2018-06-21
Method of fabricating highly conductive low-ohmic chip resistor having electrodes of base metal or base-metal alloy Grant 9,928,947 - Lee March 27, 2	2018-03-27
Block Layer in the Metal Gate of MOS Devices App 20170323940 - Tsao; Jung-Chih ; et al.	2017-11-09
Block layer in the metal gate of MOS devices Grant 9,735,231 - Tsao , et al. August 15, 2	2017-08-15
Method of Fabricating High-Conductivity Thick-film Copper Paste Coated with Nano-Silver for Being Sintered in the Air App 20170218512 - Lee; Wen-Hsi ; et al.	2017-08-03
Fabrication Method Of Magnetic Device App 20170173873 - Huang; Wei-Chin ; et al.	2017-06-22
Method of Fabricating High-Conductivity Thick-Film Aluminum Paste App 20170166759 - Lee; Wen-Hsi	2017-06-15
Chip resistor device having terminal electrodes Grant 9,552,908 - Lee January 24, 2	2017-01-24
Device of Chip Resistor with Terminal Electrodes App 20160372242 - Lee; Wen-Hsi	2016-12-22
Block Layer In The Metal Gate Of Mos Devices App 20150279838 - Tsao; Jung-Chih ; et al.	2015-10-01
Semiconductor Device And Formation Thereof App 20150235953 - Tsao; Jung-Chih ; et al.	2015-08-20
Order vacancy compound and method of manufacturing the same Grant 8,815,632 - Lee August 26, 2	2014-08-26
Self-forming Barrier Structure And Semiconductor Device Having The Same App 20140151884 - Lee; Wen-Hsi ; et al.	2014-06-05
Order Vacancy Compound And Method Of Manufacturing The Same App 20140145308 - Lee; Wen-Hsi	2014-05-29
Electronic devices with hybrid high-k dielectric and fabrication methods thereof Grant 7,842,946 - Lin , et al. November 30, 2	2010-11-30
Electronic Devices With Hybrid High-k Dielectric And Fabrication Methods Thereof App 20090087944 - Lin; Wei-Ling ; et al.	2009-04-02
Electronic Devices With Hybrid High-k Dielectric And Fabrication Methods Thereof App 20080149922 - Lin; Wei-Ling ; et al.	2008-06-26
Method for reducing shrinkage during sintering low-temperature-cofired ceramics Grant 7,381,283 - Lee , et al. June 3, 2	2008-06-03
Dielectric material and the method of preparing the same Grant 7,138,352 - Lee , et al. November 21, 2	2006-11-21
Dielectric material and the method of preparing the same App 20060079391 - Lee; Wen-Hsi ; et al.	2006-04-13
Multilayer ceramic composition Grant 6,893,710 - Lee , et al. May 17, 2	2005-05-17
Ultralow firing temperature compensating ceramic composition for pure silver electrode, sintering flux and laminated ceramic element obtained therefrom App 20050095464 - Lee, Wen-Hsi ; et al.	2005-05-05
Multilayer ceramic composition App 20040209055 - Lee, Wen-Hsi ; et al.	2004-10-21
Method for reducing shrinkage during sintering low-temperature confired ceramics App 20040196638 - Lee, Wen-Hsi ; et al.	2004-10-07
Method and constrain layer for reducing shrinkage during sintering low-temperature ceramic App 20030168150 - Lee, Wen-Hsi ; et al.	2003-09-11
Capacitor comprising a BCZT dielectric Grant 6,437,970 - Lee , et al. August 20, 2	2002-08-20

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