LEE; Wei Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Wei Ju.The latest application filed is for "conductive rail structure for semiconductor devices".

Company Profile

6.5.13

LEE; Wei Ju - Hsinchu TW
Lee; Wei Ju - Hsinchu City TW
LEE; Wei-Ju - Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive Rail Structure for Semiconductor Devices App 20220246522 - Liao; Yi-Bo ; et al.	2022-08-04
Barrier-free Interconnect Structure And Manufacturing Method Thereof App 20220199523 - Wang; Pei-Yu ; et al.	2022-06-23
Conductive rail structure for semiconductor devices Grant 11,309,240 - Liao , et al. April 19, 2	2022-04-19
Barrier-free interconnect structure and manufacturing method thereof Grant 11,276,637 - Wang , et al. March 15, 2	2022-03-15
Multi-Gate Device and Fabrication Methods Thereof App 20220059652 - Wang; Pei-Yu ; et al.	2022-02-24
Source/Drain Contact Structure App 20210366907 - Liao; Yi-Bo ; et al.	2021-11-25
Multi-gate device with air gap spacer and fabrication methods thereof Grant 11,177,344 - Wang , et al. November 16, 2	2021-11-16
Structure and Method of Integrated Circuit Having Decouple Capacitance App 20210305249 - Tsai; Ching-Wei ; et al.	2021-09-30
Method and Device for Boosting Performance of FinFETS via Strained Spacer App 20210217890 - Yang; Kai-Chieh ; et al.	2021-07-15
Structure and method of integrated circuit having decouple capacitance Grant 11,037,925 - Tsai , et al. June 15, 2	2021-06-15
Conductive Rail Structure For Semiconductor Devices App 20210134718 - LIAO; Yi-Bo ; et al.	2021-05-06
Semiconductor Device And Manufacturing Method Thereof App 20210126135 - LEE; Wei-Ju ; et al.	2021-04-29
Structure And Method Of Integrated Circuit Having Decouple Capacitance App 20210118882 - Tsai; Ching-Wei ; et al.	2021-04-22
Method and device for boosting performance of FinFETs via strained spacer Grant 10,964,816 - Yang , et al. March 30, 2	2021-03-30
Multi-Gate Device and Fabrication Methods Thereof App 20210091179 - Wang; Pei-Yu ; et al.	2021-03-25
Barrier-Free Interconnect Structure and Manufacturing Method Thereof App 20210082803 - Wang; Pei-Yu ; et al.	2021-03-18
Multi-Gate Devices And Method Of Fabrication Thereof App 20210066477 - Lee; Wei Ju ; et al.	2021-03-04
Method and Device for Boosting Performance of FinFETS via Strained Spacer App 20200105930 - Yang; Kai-Chieh ; et al.	2020-04-02

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