loadpatents
name:-0.0086939334869385
name:-0.0062479972839355
name:-0.0035369396209717
Lee; Wei-Hua Patent Filings

Lee; Wei-Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Wei-Hua.The latest application filed is for "three-dimensioanl printing apparatus".

Company Profile
3.6.6
  • Lee; Wei-Hua - New Taipei TW
  • Lee; Wei-Hua - New Taipei City TW
  • Lee; Wei Hua - Taoyuan N/A TW
  • Lee; Wei-Hua - Hsin-Chu TW
  • LEE; Wei Hua - Taoyuan City TW
  • Lee; Wei-Hua - Hsin-Chu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stereo lithography three-dimensional printing apparatus and method of forming colored three-dimensional object
Grant 10,788,752 - Lee , et al. September 29, 2
2020-09-29
Three-dimensional printing device
Grant 10,751,942 - Lee , et al. A
2020-08-25
Three-dimensioanl Printing Apparatus
App 20190111624 - Lee; Wei-Hua ;   et al.
2019-04-18
Three-dimensional Printing Device
App 20180333917 - Lee; Wei-Hua ;   et al.
2018-11-22
Three-dimensional Printing Apparatus And Method For Three-dimensional Printing
App 20180239251 - LEE; Wei-Hua ;   et al.
2018-08-23
Portable electronic device and camera module therefor
Grant 8,390,721 - Liu , et al. March 5, 2
2013-03-05
Fabrication of wafer-level test module for testing image sensor chips
Grant 7,589,033 - Lu , et al. September 15, 2
2009-09-15
Portable Electronic Device And Camera Module Therefor
App 20090009650 - LIU; Hsien Hsun ;   et al.
2009-01-08
Wafer-level test module for testing image sensor chips, the related test method and fabrication
App 20080280382 - Lu; Sheng-Feng ;   et al.
2008-11-13
Wafer-level test module for testing image sensor chips, the related test method and fabrication
Grant 7,414,423 - Lu , et al. August 19, 2
2008-08-19
Wafer-level test module for testing image sensor chips, the related test method and fabrication
App 20080136434 - Lu; Sheng-Feng ;   et al.
2008-06-12
Company Registrations

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