loadpatents
name:-0.010234117507935
name:-0.013244867324829
name:-0.0031609535217285
Lee; Wei-Hsuan Patent Filings

Lee; Wei-Hsuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Wei-Hsuan.The latest application filed is for "multi-moldings fan-out package and process".

Company Profile
2.13.11
  • Lee; Wei-Hsuan - Kaohsiung TW
  • Lee; Wei-Hsuan - Kaoshsiung TW
  • Lee; Wei-Hsuan - New Taipei TW
  • Lee; Wei-Hsuan - NEW TAIPEI CITY TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-moldings fan-out package and process
Grant 11,152,274 - Lee , et al. October 19, 2
2021-10-19
Semiconductor package device and method of manufacturing the same
Grant 10,756,025 - Lee , et al. A
2020-08-25
Multi-moldings Fan-out Package And Process
App 20190080975 - LEE; Wei-Hsuan ;   et al.
2019-03-14
Semiconductor device including electric and magnetic field shielding
Grant 10,157,855 - Lee , et al. Dec
2018-12-18
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180350753 - LEE; Wei-Hsuan ;   et al.
2018-12-06
Semiconductor package device and method of manufacturing the same
Grant 10,068,854 - Lee , et al. September 4, 2
2018-09-04
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20180114758 - YAO; Chih Sheng ;   et al.
2018-04-26
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180114757 - LEE; Wei-Hsuan ;   et al.
2018-04-26
Semiconductor device package and a method of manufacturing the same
Grant 9,953,931 - Yao , et al. April 24, 2
2018-04-24
Semiconductor device packages and method of making the same
Grant 9,653,415 - Lee , et al. May 16, 2
2017-05-16
Semiconductor Device Package And Method Of Manufacturing The Same
App 20160358862 - Lee; Wei-Hsuan ;   et al.
2016-12-08
Semiconductor Device Packages And Method Of Making The Same
App 20160240493 - LEE; Wei-Hsuan ;   et al.
2016-08-18
Semiconductor device package and method of manufacturing the same
Grant 9,397,074 - Lee , et al. July 19, 2
2016-07-19
Tunable radio frequency coupler and manufacturing method thereof
Grant 9,123,981 - Liu , et al. September 1, 2
2015-09-01
Tunable Radio Frequency Coupler And Manufacturing Method Thereof
App 20150244053 - LIU; CHIEN-YEH ;   et al.
2015-08-27
Adaptive antenna module in active IC package
Grant 9,020,420 - Peng , et al. April 28, 2
2015-04-28
Electronic system, RF power amplifier and temperature compensation method thereof
Grant 8,879,666 - Ding , et al. November 4, 2
2014-11-04
Electronic system, RF power amplifier and temperature compensation method thereof
Grant 8,847,686 - Ding , et al. September 30, 2
2014-09-30
Electronic system, RF power amplifier and output power compensation method thereof
Grant 8,791,761 - Ding , et al. July 29, 2
2014-07-29
Electronic System, Rf Power Amplifier And Output Power Compensation Method Thereof
App 20140159819 - DING; JAW-MING ;   et al.
2014-06-12
Electronic System, Rf Power Amplifier And Temperature Compensation Method Thereof
App 20140153670 - DING; JAW-MING ;   et al.
2014-06-05
Electronic System, Rf Power Amplifier And Temperature Compensation Method Thereof
App 20140132350 - DING; JAW-MING ;   et al.
2014-05-15
Adaptive Antenna Module In Active IC Package
App 20120208480 - Peng; Ching-Juang ;   et al.
2012-08-16

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