LEE; Wang Gu

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Wang Gu.The latest application filed is for "semiconductor devices and methods of manufacturing semiconductor devices".

Company Profile

5.6.11

LEE; Wang Gu - Seoul KR
Lee; Wang Gu - Goyang-si KR
Lee; Wang Gu - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Devices And Methods Of Manufacturing Semiconductor Devices App 20220254694 - LEE; Wang Gu ; et al.	2022-08-11
Semiconductor Device And Manufacturing Method Thereof App 20220148886 - Paek; Jong Sik ; et al.	2022-05-12
Semiconductor device and manufacturing method thereof Grant 11,101,144 - Paek , et al. August 24, 2	2021-08-24
Semiconductor Device And Manufacturing Method Thereof App 20200303212 - Paek; Jong Sik ; et al.	2020-09-24
Semiconductor device and manufacturing method thereof Grant 10,515,825 - Paek , et al. Dec	2019-12-24
Semiconductor device and manufacturing method thereof Grant 10,388,582 - Kim , et al. A	2019-08-20
Semiconductor Device And Manufacturing Method Thereof App 20190067035 - Paek; Jong Sik ; et al.	2019-02-28
Semiconductor device and manufacturing method thereof Grant 10,079,157 - Paek , et al. September 18, 2	2018-09-18
Semiconductor Device And Manufacturing Method Thereof App 20180226312 - Kim; Young Rae ; et al.	2018-08-09
Semiconductor device and manufacturing method thereof Grant 9,941,180 - Kim , et al. April 10, 2	2018-04-10
Semiconductor package with semiconductor die directly attached to lead frame and method Grant 9,711,484 - Paek , et al. July 18, 2	2017-07-18
Semiconductor Device And Manufacturing Method Thereof App 20170117200 - Kim; Young Rae ; et al.	2017-04-27
Semiconductor Device And Manufacturing Method Thereof App 20160379915 - Lee; Wang Gu ; et al.	2016-12-29
Semiconductor Device And Manufacturing Method Thereof App 20160189980 - Paek; Jong Sik ; et al.	2016-06-30
Semiconductor Package With Semiconductor Die Directly Attached To Lead Frame And Method App 20160141229 - Paek; Jong Sik ; et al.	2016-05-19
Semiconductor Device With Plated Conductive Pillar Coupling App 20150021767 - Park; Doo Hyun ; et al.	2015-01-22

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.