loadpatents
name:-0.0081610679626465
name:-0.0060911178588867
name:-0.0036280155181885
Lee; Tzy-Kuang Patent Filings

Lee; Tzy-Kuang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Tzy-Kuang.The latest application filed is for "redistribution layer features".

Company Profile
4.5.9
  • Lee; Tzy-Kuang - Hsinchu TW
  • LEE; Tzy-Kuang - Taichung TW
  • Lee; Tzy-Kuang - Taichung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package component with stepped passivation layer
Grant 11,450,567 - Cheng , et al. September 20, 2
2022-09-20
Redistribution Layer Features
App 20220223536 - Wang; Wen-Chun ;   et al.
2022-07-14
Package Component with Stepped Passivation Layer
App 20210375675 - Cheng; Ming-Da ;   et al.
2021-12-02
Capacitor Between Two Passivation Layers With Different Etching Rates
App 20210375748 - HUANG; Chia-Ming ;   et al.
2021-12-02
Redistribution Lines Having Nano Columns and Method Forming Same
App 20210375672 - Cheng; Ming-Da ;   et al.
2021-12-02
Blocking Structures on Isolation Structures
App 20210175071 - Yang; Yu-Hsuan ;   et al.
2021-06-10
Blocking structures on isolation structures
Grant 10,930,502 - Yang , et al. February 23, 2
2021-02-23
Blocking Structures on Isolation Structures
App 20190244807 - Yang; Yu-Hsuan ;   et al.
2019-08-08
Blocking Structures on Isolation Structures
App 20190164744 - Yang; Yu-Hsuan ;   et al.
2019-05-30
Blocking structures on isolation structures
Grant 10,283,361 - Yang , et al.
2019-05-07
System and method of monitoring and controlling temperature of semiconductor substrates in FOUP
Grant 10,156,478 - Liu , et al. Dec
2018-12-18
Fuse structures and forming and operation methods thereof
Grant 9,934,925 - Tsai , et al. April 3, 2
2018-04-03
Fuse Structures And Forming And Operation Methods Thereof
App 20170140891 - Tsai; Chia-Chou ;   et al.
2017-05-18
System And Method Of Monitoring And Controlling Temperature Of Semiconductor Substrates In Foup
App 20170074727 - LIU; Chun-Chang ;   et al.
2017-03-16

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