loadpatents
Patent applications and USPTO patent grants for Lee; Tzy-Kuang.The latest application filed is for "redistribution layer features".
Patent | Date |
---|---|
Package component with stepped passivation layer Grant 11,450,567 - Cheng , et al. September 20, 2 | 2022-09-20 |
Redistribution Layer Features App 20220223536 - Wang; Wen-Chun ;   et al. | 2022-07-14 |
Package Component with Stepped Passivation Layer App 20210375675 - Cheng; Ming-Da ;   et al. | 2021-12-02 |
Capacitor Between Two Passivation Layers With Different Etching Rates App 20210375748 - HUANG; Chia-Ming ;   et al. | 2021-12-02 |
Redistribution Lines Having Nano Columns and Method Forming Same App 20210375672 - Cheng; Ming-Da ;   et al. | 2021-12-02 |
Blocking Structures on Isolation Structures App 20210175071 - Yang; Yu-Hsuan ;   et al. | 2021-06-10 |
Blocking structures on isolation structures Grant 10,930,502 - Yang , et al. February 23, 2 | 2021-02-23 |
Blocking Structures on Isolation Structures App 20190244807 - Yang; Yu-Hsuan ;   et al. | 2019-08-08 |
Blocking Structures on Isolation Structures App 20190164744 - Yang; Yu-Hsuan ;   et al. | 2019-05-30 |
Blocking structures on isolation structures Grant 10,283,361 - Yang , et al. | 2019-05-07 |
System and method of monitoring and controlling temperature of semiconductor substrates in FOUP Grant 10,156,478 - Liu , et al. Dec | 2018-12-18 |
Fuse structures and forming and operation methods thereof Grant 9,934,925 - Tsai , et al. April 3, 2 | 2018-04-03 |
Fuse Structures And Forming And Operation Methods Thereof App 20170140891 - Tsai; Chia-Chou ;   et al. | 2017-05-18 |
System And Method Of Monitoring And Controlling Temperature Of Semiconductor Substrates In Foup App 20170074727 - LIU; Chun-Chang ;   et al. | 2017-03-16 |
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