Lee; Tung Chun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Tung Chun.The latest application filed is for "method for encapsulating a nanostructure, coated nanostructure and use of a coated nanostructure".
- Lee; Tung Chun - Hong Kong CN
- Lee; Tung-Chun - Cambridge N/A GB
| Patent | Date |
|---|---|
| Method for encapsulating a nanostructure, coated nanostructure and use of a coated nanostructure Grant 10,464,037 - Jeong , et al. No | 2019-11-05 |
| Plasmonic junctions for surface-enhanced spectroscopy Grant 10,073,037 - Taylor , et al. September 11, 2 | 2018-09-11 |
| Method For Encapsulating A Nanostructure, Coated Nanostructure And Use Of A Coated Nanostructure App 20180117560 - Jeong; Hyeon-Ho ; et al. | 2018-05-03 |
| Plasmonic Junctions For Surface-enhanced Spectroscopy App 20140113382 - Taylor; Richard William ; et al. | 2014-04-24 |
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