loadpatents
Patent applications and USPTO patent grants for Lee; Tsung-Hsun.The latest application filed is for "method of inspecting power units".
Patent | Date |
---|---|
Method of inspecting power units Grant 11,320,465 - Wu , et al. May 3, 2 | 2022-05-03 |
Method Of Inspecting Power Units App 20210349130 - WU; Chih-Ming ;   et al. | 2021-11-11 |
Lithography system and lithography method Grant 10,678,148 - Chang , et al. | 2020-06-09 |
Lithography System And Lithography Method App 20200041914 - CHANG; Kai-Chieh ;   et al. | 2020-02-06 |
Wafer or reticle thermal deformation measuring techniques Grant 9,574,875 - Lee , et al. February 21, 2 | 2017-02-21 |
Substrate structure and package structure using the same Grant 9,578,737 - Chen , et al. February 21, 2 | 2017-02-21 |
Wafer Or Reticle Thermal Deformation Measuring Techniques App 20150204665 - Lee; Tsung-Hsun ;   et al. | 2015-07-23 |
Substrate Structure And Package Structure Using The Same App 20140144683 - CHEN; Kuo-Hua ;   et al. | 2014-05-29 |
Substrate structure and package structure using the same Grant 8,665,605 - Chen , et al. March 4, 2 | 2014-03-04 |
Substrate Structure And Package Structure Using The Same App 20100206622 - Chen; Kuo-Hua ;   et al. | 2010-08-19 |
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