Lee; Tsung-Ho
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Tsung-Ho.The latest application filed is for "cmp compositions and methods for polishing nickel phosphorous surfaces".
- Lee; Tsung-Ho - Tainan TW
- Lee; Tsung-Ho - Tainan City TW
- Lee, Tsung Ho - Kaohsiung TW
- Lee, Tsung-Ho - Ligang Shiang TW
- Lee, Tsung-Ho - Ping Tong Hsien TW
| Patent | Date |
|---|---|
| CMP compositions and methods for polishing nickel phosphorous surfaces Grant 10,358,579 - Zhang , et al. July 23, 2 | 2019-07-23 |
| Cmp Compositions And Methods For Polishing Nickel Phosphorous Surfaces App 20150152289 - Zhang; Ke ; et al. | 2015-06-04 |
| Chemical mechanical abrasive slurry and method of using the same App 20050112892 - Chen, Pao Cheng ; et al. | 2005-05-26 |
| Process and slurry for chemical mechanical polishing App 20050009714 - Chen, Pao Cheng ; et al. | 2005-01-13 |
| Method of polishing a semiconductor wafer surface App 20030064596 - Lee, Tsung-Ho ; et al. | 2003-04-03 |
| Chemical mechanical abrasive composition for use in semiconductor processing Grant 6,508,952 - Lee , et al. January 21, 2 | 2003-01-21 |
| Chemical mechanical abrasive composition for use in semiconductor processing Grant 6,303,049 - Lee , et al. October 16, 2 | 2001-10-16 |
| Chemical mechanical abrasive composition for use in semiconductor processing Grant 6,171,352 - Lee , et al. January 9, 2 | 2001-01-09 |
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