| Patent | Date |
|---|
Stacked silicon package assembly having thermal management
Grant 11,355,412 - Gandhi , et al. June 7, 2 | 2022-06-07 |
Chip package assembly with enhanced solder resist crack resistance
Grant 11,315,858 - Sun , et al. April 26, 2 | 2022-04-26 |
Chip-scale LED package structure
Grant 11,257,795 - Lee , et al. February 22, 2 | 2022-02-22 |
Solder joints for board level reliability
Grant 10,930,611 - Gandhi , et al. February 23, 2 | 2021-02-23 |
Chip-scale Led Package Structure
App 20200235079 - LEE; TIEN-YU ; et al. | 2020-07-23 |
Light Emitting Package Structure And Method Of Manufacturing The Same
App 20200176648 - CHEN; CHIH-YUAN ; et al. | 2020-06-04 |
Stacked Silicon Package Assembly Having Thermal Management
App 20200105642 - Gandhi; Jaspreet Singh ; et al. | 2020-04-02 |
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
Grant 10,529,645 - Gandhi , et al. J | 2020-01-07 |
Testing system for lid-less integrated circuit packages
Grant 10,527,670 - Refai-Ahmed , et al. J | 2020-01-07 |
Chip package assembly with enhanced interconnects and method for fabricating the same
Grant 10,319,606 - Gandhi , et al. | 2019-06-11 |
Methods And Apparatus For Thermal Interface Material (tim) Bond Line Thickness (blt) Reduction And Tim Adhesion Enhancement For Efficient Thermal Management
App 20180358280 - Gandhi; Jaspreet Singh ; et al. | 2018-12-13 |
Method and apparatus for assembling and testing a multi-integrated circuit package
Grant 10,096,502 - Refai-Ahmed , et al. October 9, 2 | 2018-10-09 |
Testing System For Lid-less Integrated Circuit Packages
App 20180284187 - Refai-Ahmed; Gamal ; et al. | 2018-10-04 |
Stacked silicon package assembly having an enhanced lid
Grant 10,043,730 - Refai-Ahmed , et al. August 7, 2 | 2018-08-07 |
Method And Apparatus For Assembling And Testing A Multi-integrated Circuit Package
App 20180144963 - Refai-Ahmed; Gamal ; et al. | 2018-05-24 |
LED package structure
Grant 9,653,669 - Chen , et al. May 16, 2 | 2017-05-16 |
Stacked Silicon Package Assembly Having An Enhanced Lid
App 20170092619 - Refai-Ahmed; Gamal ; et al. | 2017-03-30 |
Led Package Structure
App 20160336498 - CHEN; CHIH-YUAN ; et al. | 2016-11-17 |
LED package structure and manufacturing method thereof
Grant 9,455,387 - Chen , et al. September 27, 2 | 2016-09-27 |
Led Package Structure And Manufacturing Method Thereof
App 20160260877 - CHEN; CHIH-YUAN ; et al. | 2016-09-08 |
Multi-use package substrate
Grant 9,204,542 - Lee , et al. December 1, 2 | 2015-12-01 |
Led Device
App 20120194067 - WU; CHIA-HAO ; et al. | 2012-08-02 |
LED device and packaging method thereof
Grant 8,216,864 - Wu , et al. July 10, 2 | 2012-07-10 |
Led Device And Packaging Method Thereof
App 20100276713 - WU; Chia-Hao ; et al. | 2010-11-04 |
Photoelectric Semiconductor Device
App 20100200879 - Lee; Tien-Yu ; et al. | 2010-08-12 |
Light emitting diode
Grant 7,741,651 - Wu , et al. June 22, 2 | 2010-06-22 |
Light emitting diode
App 20080272385 - Wu; Chia-Hao ; et al. | 2008-11-06 |
| 