loadpatents
name:-0.0089640617370605
name:-0.0020639896392822
name:-0.0012810230255127
LEE; TEAKHOON Patent Filings

LEE; TEAKHOON

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; TEAKHOON.The latest application filed is for "semiconductor package including mold layer and manufacturing method thereof".

Company Profile
1.3.9
  • LEE; TEAKHOON - Hwaseong-si KR
  • LEE; Teakhoon - Suwon-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package Including Mold Layer And Manufacturing Method Thereof
App 20220293563 - KO; YEONGKWON ;   et al.
2022-09-15
Semiconductor Package
App 20220285312 - HWANG; Jihwan ;   et al.
2022-09-08
Semiconductor package
Grant 11,362,062 - Hwang , et al. June 14, 2
2022-06-14
Semiconductor Package Including Underfill And Method For Manufacturing The Same
App 20220013474 - YOO; Jaekyung ;   et al.
2022-01-13
Package Structures Having Underfills
App 20220013496 - PARK; Jinwoo ;   et al.
2022-01-13
Semiconductor Package
App 20210375823 - HWANG; Jihwan ;   et al.
2021-12-02
Wafer Trimming Device
App 20210320000 - AHN; Jungseok ;   et al.
2021-10-14
Semiconductor Packages And Methods Of Manufacturing The Same
App 20210028098 - YOO; JAEKYUNG ;   et al.
2021-01-28
Methods For Semiconductor Package
App 20160086912 - Lee; Teakhoon
2016-03-24
Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
Grant 9,245,787 - Jeon , et al. January 26, 2
2016-01-26
Apparatus Of Manufacturing Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages Using The Same
App 20120313332 - Jeon; Chang-Seong ;   et al.
2012-12-13

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