loadpatents
Patent applications and USPTO patent grants for LEE; TEAKHOON.The latest application filed is for "semiconductor package including mold layer and manufacturing method thereof".
Patent | Date |
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Semiconductor Package Including Mold Layer And Manufacturing Method Thereof App 20220293563 - KO; YEONGKWON ;   et al. | 2022-09-15 |
Semiconductor Package App 20220285312 - HWANG; Jihwan ;   et al. | 2022-09-08 |
Semiconductor package Grant 11,362,062 - Hwang , et al. June 14, 2 | 2022-06-14 |
Semiconductor Package Including Underfill And Method For Manufacturing The Same App 20220013474 - YOO; Jaekyung ;   et al. | 2022-01-13 |
Package Structures Having Underfills App 20220013496 - PARK; Jinwoo ;   et al. | 2022-01-13 |
Semiconductor Package App 20210375823 - HWANG; Jihwan ;   et al. | 2021-12-02 |
Wafer Trimming Device App 20210320000 - AHN; Jungseok ;   et al. | 2021-10-14 |
Semiconductor Packages And Methods Of Manufacturing The Same App 20210028098 - YOO; JAEKYUNG ;   et al. | 2021-01-28 |
Methods For Semiconductor Package App 20160086912 - Lee; Teakhoon | 2016-03-24 |
Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same Grant 9,245,787 - Jeon , et al. January 26, 2 | 2016-01-26 |
Apparatus Of Manufacturing Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages Using The Same App 20120313332 - Jeon; Chang-Seong ;   et al. | 2012-12-13 |
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