Lee; Te-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Te-Hao.The latest application filed is for "mems devices and methods of forming same".
Company Profile
5.26.28
- Lee; Te-Hao - Hsinchu TW
- Lee; Te-Hao - Taipei TW
- Lee; Te-Hao - Taipei City TW
- Lee; Te-Hao - Hsin-Chu N/A TW
Patent Activity
| Patent | Date |
|---|---|
| MEMS devices and methods of forming same Grant 11,180,365 - Liang , et al. November 23, 2 | 2021-11-23 |
| Narrow gap device with parallel releasing structure Grant 11,018,218 - Chang , et al. May 25, 2 | 2021-05-25 |
| Narrow gap device with parallel releasing structure Grant 11,011,601 - Chang , et al. May 18, 2 | 2021-05-18 |
| MEMS Devices and Methods of Forming Same App 20200062588 - Liang; Kai-Chih ; et al. | 2020-02-27 |
| Narrow Gap Device With Parallel Releasing Structure App 20200020763 - Chang; Kuei-Sung ; et al. | 2020-01-16 |
| Narrow Gap Device With Parallel Releasing Structure App 20200020764 - Chang; Kuei-Sung ; et al. | 2020-01-16 |
| Narrow gap device with parallel releasing structure Grant 10,497,776 - Chang , et al. De | 2019-12-03 |
| MEMS devices and methods of forming same Grant 10,457,550 - Liang , et al. Oc | 2019-10-29 |
| MEMS Devices and Methods of Forming Same App 20190047851 - Liang; Kai-Chih ; et al. | 2019-02-14 |
| MEMS devices and fabrication methods thereof Grant 10,160,633 - Chu , et al. Dec | 2018-12-25 |
| MEMS devices and fabrication methods thereof Grant 10,155,655 - Chu , et al. Dec | 2018-12-18 |
| MEMS devices and methods of forming same Grant 10,099,919 - Liang , et al. October 16, 2 | 2018-10-16 |
| Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same Grant 10,071,905 - Chu , et al. September 11, 2 | 2018-09-11 |
| Dual layer microelectromechanical systems device and method of manufacturing same Grant 9,617,147 - Chu , et al. April 11, 2 | 2017-04-11 |
| Wafer rotating apparatus Grant 9,611,548 - Chang , et al. April 4, 2 | 2017-04-04 |
| Mems Devices And Methods Of Forming Same App 20170066647 - Liang; Kai-Chih ; et al. | 2017-03-09 |
| Micro-electro Mechanical System (mems) Structures With Through Substrate Vias And Methods Of Forming The Same App 20170022049 - CHU; Chia-Hua ; et al. | 2017-01-26 |
| MEMS Devices and Fabrication Methods Thereof App 20170008758 - Chu; Chia-Hua ; et al. | 2017-01-12 |
| MEMS Devices and Fabrication Methods Thereof App 20170001860 - Chu; Chia-Hua ; et al. | 2017-01-05 |
| MEMS devices and methods of forming same Grant 9,499,396 - Liang , et al. November 22, 2 | 2016-11-22 |
| Wafer Rotating Apparatus App 20160322244 - Chang; Yuan-Hao ; et al. | 2016-11-03 |
| MEMS devices and fabrication methods thereof Grant 9,452,924 - Chu , et al. September 27, 2 | 2016-09-27 |
| MEMS devices and fabrication methods thereof Grant 9,450,109 - Chu , et al. September 20, 2 | 2016-09-20 |
| MEMS structure with adaptable inter-substrate bond Grant 9,133,017 - Liang , et al. September 15, 2 | 2015-09-15 |
| Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same App 20150217996 - Chu; Chia-Hua ; et al. | 2015-08-06 |
| MEMS Devices and Methods of Forming Same App 20150158723 - Liang; Kai-Chih ; et al. | 2015-06-11 |
| Dual layer microelectromechanical systems device and method of manufacturing same Grant 9,006,015 - Chu , et al. April 14, 2 | 2015-04-14 |
| MEMS devices and methods of forming same Grant 8,987,059 - Liang , et al. March 24, 2 | 2015-03-24 |
| MEMS devices Grant 8,969,979 - Lee , et al. March 3, 2 | 2015-03-03 |
| Narrow Gap Device With Parallel Releasing Structure App 20140374885 - Chang; Kuei-Sung ; et al. | 2014-12-25 |
| MEMS Structure with Adaptable Inter-Substrate Bond App 20140353776 - Liang; Kai-Chih ; et al. | 2014-12-04 |
| High aspect ratio MEMS devices and methods for forming the same Grant 8,828,772 - Lee September 9, 2 | 2014-09-09 |
| Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same App 20140206123 - Chu; Chia-Hua ; et al. | 2014-07-24 |
| MEMS structure with adaptable inter-substrate bond Grant 8,748,205 - Liang , et al. June 10, 2 | 2014-06-10 |
| Mems Structure With Adaptable Inter-substrate Bond App 20140151821 - Liang; Kai-Chih ; et al. | 2014-06-05 |
| MEMS devices and methods for forming the same Grant 8,729,646 - Chu , et al. May 20, 2 | 2014-05-20 |
| MEMS Devices and Methods for Forming the Same App 20140103462 - Lee; Te-Hao ; et al. | 2014-04-17 |
| MEMS Devices and Fabrication Methods Thereof App 20140103461 - Chu; Chia-Hua ; et al. | 2014-04-17 |
| MEMS Devices and Methods for Forming the Same App 20140042562 - Chu; Chia-Hua ; et al. | 2014-02-13 |
| Methods for forming MEMS devices Grant 8,623,768 - Lee , et al. January 7, 2 | 2014-01-07 |
| MEMS Devices and Fabrication Methods Thereof App 20130334620 - Chu; Chia-Hua ; et al. | 2013-12-19 |
| High Aspect Ratio Mems Devices And Methods For Forming The Same App 20130230939 - LEE; Te-Hao | 2013-09-05 |
| Micro-electro Mechanical System (mems) Structures With Through Substrate Vias And Methods Of Forming The Same App 20130193527 - CHU; Chia-Hua ; et al. | 2013-08-01 |
| MEMS Devices and Methods of Forming Same App 20130168852 - Liang; Kai-Chih ; et al. | 2013-07-04 |
| MEMS Devices and Methods for Forming the Same App 20130140650 - Lee; Te-Hao ; et al. | 2013-06-06 |
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