Lee; Tai-Peng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Tai-Peng.The latest application filed is for "use of teos oxides in integrated circuit fabrication processes".

Company Profile

0.7.8

Lee; Tai-Peng - Milpitas CA
Lee; Tai-Peng - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Use of TEOS oxides in integrated circuit fabrication processes Grant 7,371,695 - Lee , et al. May 13, 2	2008-05-13
Use Of Teos Oxides In Integrated Circuit Fabrication Processes App 20070290292 - Lee; Tai-Peng ; et al.	2007-12-20
Use of chlorine to fabricate trench dielectric in integrated circuits Grant 7,265,015 - Dong , et al. September 4, 2	2007-09-04
Use of TEOS oxides in integrated circuit fabrication processes App 20070155189 - Lee; Tai-Peng ; et al.	2007-07-05
Use Of Chlorine To Fabricate Trench Dielectric In Integrated Circuits App 20070128800 - Dong; Zhong ; et al.	2007-06-07
Use of chlorine to fabricate trench dielectric in integrated circuits App 20070004136 - Dong; Zhong ; et al.	2007-01-04
Control of air gap position in a dielectric layer Grant 7,087,998 - Lee , et al. August 8, 2	2006-08-08
Reduced thickness variation in a material layer deposited in narrow and wide integrated circuit trenches Grant 7,026,172 - Lee , et al. April 11, 2	2006-04-11
Low temperature nitridation of amorphous high-K metal-oxide in inter-gates insulator stack Grant 6,933,218 - Lee , et al. August 23, 2	2005-08-23
Method of making a silicon nitride film that is transmissive to ultraviolet light Grant 6,924,241 - Lee August 2, 2	2005-08-02
Control of air gap position in a dielectric layer Grant 6,881,668 - Lee , et al. April 19, 2	2005-04-19
Control of air gap position in a dielectric layer App 20050051865 - Lee, Tai-Peng ; et al.	2005-03-10
Control Of Air Gap Position In A Dielectric Layer App 20050051864 - Lee, Tai-Peng ; et al.	2005-03-10
Method of making a silicon nitride film that is transmissive to ultraviolet light App 20040166696 - Lee, Tai-Peng	2004-08-26
Reduced thickness variation in a material layer deposited in norrow and wide integrated circuit trenches App 20030077888 - Lee, Tai-Peng ; et al.	2003-04-24

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