Lee; TaeKeun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; TaeKeun.The latest application filed is for "die-beam alignment for laser-assisted bonding".

Company Profile

3.12.12

Lee; TaeKeun - Incheon KR
Lee; Taekeun - Chilgok-gun KR
Lee; TaeKeun - Kyungki-do N/A KR
Lee; Taekeun - Ichon-si KR
Lee; TaeKeun - Kyoung-gi-Do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die-Beam Alignment for Laser-Assisted Bonding App 20210296268 - Braganca, JR.; Wagno Alves ; et al.	2021-09-23
Display device Grant 10,845,639 - Lee , et al. November 24, 2	2020-11-24
Display panel having built-in touchscreen and touch display device including the same Grant 10,635,208 - Lee , et al.	2020-04-28
Display Device App 20190204671 - LEE; Taekeun ; et al.	2019-07-04
In-cell touch liquid crystal display apparatus Grant 9,837,007 - Kang , et al. December 5, 2	2017-12-05
Display Panel Having Built-in Touchscreen And Touch Display Device Including The Same App 20170115809 - LEE; TaeKeun ; et al.	2017-04-27
In-cell Touch Liquid Crystal Display Apparatus App 20160189582 - KANG; In ; et al.	2016-06-30
Filp chip interconnection structure with bump on partial pad and method thereof Grant 9,125,332 - Pendse , et al. September 1, 2	2015-09-01
Plastic ball grid array package with integral heatsink Grant 8,030,756 - Lee , et al. October 4, 2	2011-10-04
Standoff height improvement for bumping technology using solder resist Grant 7,875,495 - Kang , et al. January 25, 2	2011-01-25
Filp Chip Interconnection Structure with Bump on Partial Pad and Method Thereof App 20100244245 - Pendse; Rajendra D. ; et al.	2010-09-30
Flip chip interconnection structure with bump on partial pad and method thereof Grant 7,759,137 - Pendse , et al. July 20, 2	2010-07-20
Standoff Height Improvement for Bumping Technology Using Solder Resist App 20100022050 - Kang; TaeWoo ; et al.	2010-01-28
Standoff height improvement for bumping technology using solder resist Grant 7,615,865 - Kang , et al. November 10, 2	2009-11-10
Flip Chip Interconnection Structure with Bump on Partial Pad and Method Thereof App 20090243080 - Pendse; Rajendra D. ; et al.	2009-10-01
Standoff Height Improvement for Bumping Technology Using Solder Resist App 20080293232 - KANG; TaeWoo ; et al.	2008-11-27
Plastic Ball Grid Array Package with Integral Heatsink App 20070176289 - Lee; Taekeun ; et al.	2007-08-02
Method for manufacturing plastic ball grid array package with integral heatsink Grant 7,217,598 - Lee , et al. May 15, 2	2007-05-15
Method for manufacturing plastic ball grid array package with integral heatsink App 20060019429 - Lee; Taekeun ; et al.	2006-01-26
Method for manufacturing plastic ball grid array with integral heatsink Grant 6,967,126 - Lee , et al. November 22, 2	2005-11-22
Plastic ball grid array with integral heatsink App 20040043539 - Lee, Taekeun ; et al.	2004-03-04
Plastic ball grid array package with integral heatsink Grant 6,614,123 - Lee , et al. September 2, 2	2003-09-02
Plastic ball grid array package with integral heatsink App 20030025215 - Lee, Taekeun ; et al.	2003-02-06

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