| Patent | Date |
|---|
Gate Driver and Organic Light Emitting Display Device Including the Same
App 20220270551 - KIM; Se-Hwan ; et al. | 2022-08-25 |
Light Emitting Diode Display Apparatus
App 20220208918 - CHO; Beum-Sik ; et al. | 2022-06-30 |
Gate driver and organic light emitting display device including the same
Grant 11,367,397 - Kim , et al. June 21, 2 | 2022-06-21 |
Scan Driver And Display Apparatus Including The Same
App 20210366403 - LEE; Tae Keun | 2021-11-25 |
Gate Driver and Organic Light Emitting Display Device Including the Same
App 20210201799 - KIM; Se-Hwan ; et al. | 2021-07-01 |
Gate driving circuit and display device using the same
Grant 10,991,302 - Park , et al. April 27, 2 | 2021-04-27 |
Subpixel structure of display device and touch screen-integrated display device having the same
Grant 10,684,711 - Lee , et al. | 2020-06-16 |
Subpixel Structure Of Display Device And Touch Screen-integrated Display Device Having The Same
App 20170153735 - LEE; Tae Keun ; et al. | 2017-06-01 |
Array substrate having integrated gate driver and method of fabricating the same
Grant 9,583,511 - Kang , et al. February 28, 2 | 2017-02-28 |
In-cell Touch Type Liquid Crystal Display Device
App 20160216544 - CHAE; Ji-Eun ; et al. | 2016-07-28 |
In-cell touch type liquid crystal display device
Grant 9,329,424 - Chae , et al. May 3, 2 | 2016-05-03 |
In-cell Touch Type Liquid Crystal Display Device
App 20160062164 - CHAE; Ji-Eun ; et al. | 2016-03-03 |
Array Substrate Having Integrated Gate Driver And Method Of Fabricating The Same
App 20160035749 - Kang; In ; et al. | 2016-02-04 |
Flat panel display device with oxide thin film transistors and method for fabricating the same
Grant 9,165,953 - Chae , et al. October 20, 2 | 2015-10-20 |
Flat Panel Display Device with Oxide Thin Film Transistors and Method for Fabricating the Same
App 20150079732 - Chae; Ji Eun ; et al. | 2015-03-19 |
Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge
App 20150001741 - Lee; Koo Hong ; et al. | 2015-01-01 |
Flat panel display device with oxide thin film transistors and method for fabricating the same
Grant 8,921,861 - Chae , et al. December 30, 2 | 2014-12-30 |
Display device
Grant 8,866,224 - Shin , et al. October 21, 2 | 2014-10-21 |
Flat panel display device with oxide thin film transistor and method for fabricating the same
Grant 8,853,686 - Chae , et al. October 7, 2 | 2014-10-07 |
Integrated circuit package system with mold gate
Grant 8,841,782 - Yang , et al. September 23, 2 | 2014-09-23 |
Reception Apparatus Used By Being Coupled To A Neck Of A Container
App 20140144864 - Lee; Seong-Jae | 2014-05-29 |
Stackable integrated circuit package system
Grant 8,729,687 - Lee , et al. May 20, 2 | 2014-05-20 |
Integrated circuit package system and method of manufacture thereof
Grant 8,633,056 - Jeon , et al. January 21, 2 | 2014-01-21 |
Display Device
App 20130270582 - Shin; Byong Wook ; et al. | 2013-10-17 |
Polyolefin composition for an interior sheet/film
Grant 8,470,920 - Kwon , et al. June 25, 2 | 2013-06-25 |
Flat Panel Display Device With Oxide Thin Film Transistor And Method For Fabricating The Same
App 20130056726 - Chae; Ji Eun ; et al. | 2013-03-07 |
Flat Panel Display Device with Oxide Thin Film Transistors and Method for Fabricating the Same
App 20130056724 - Chae; Ji Eun ; et al. | 2013-03-07 |
Stackable Integrated Circuit Package System
App 20130032954 - Lee; Hun Teak ; et al. | 2013-02-07 |
Polyolefin Composition For An Interior Sheet/film
App 20130005893 - Kwon; Sang Min ; et al. | 2013-01-03 |
Stackable integrated circuit package system
Grant 8,304,874 - Lee , et al. November 6, 2 | 2012-11-06 |
Semiconductor package system with thermal die bonding
Grant 8,304,922 - Lee , et al. November 6, 2 | 2012-11-06 |
Method For Fabricating A Polyolefin Sheet Using A Roller Device
App 20120235318 - Kwon; Sang Min ; et al. | 2012-09-20 |
Integrated circuit packaging system with encapsulant containment and method of manufacture thereof
Grant 8,227,903 - Lee , et al. July 24, 2 | 2012-07-24 |
Integrated Circuit Packaging System With Encapsulant Containment And Method Of Manufacture Thereof
App 20120061859 - Lee; Hye Ran ; et al. | 2012-03-15 |
Semiconductor wafer scale package system
Grant 8,114,771 - Jeon , et al. February 14, 2 | 2012-02-14 |
Integrated circuit package system with heat slug
Grant 8,035,237 - Lee , et al. October 11, 2 | 2011-10-11 |
Integrated circuit package system with a heat sink
Grant 8,030,755 - Lee , et al. October 4, 2 | 2011-10-04 |
Integrated circuit package system using heat slug
Grant 8,022,531 - Yu , et al. September 20, 2 | 2011-09-20 |
Integrated Circuit Package System Using Heat Slug
App 20100327418 - Yu; Kyungsic ; et al. | 2010-12-30 |
Integrated circuit package system using heat slug
Grant 7,851,268 - Yu , et al. December 14, 2 | 2010-12-14 |
Integrated circuit package system employing thin profile techniques
Grant 7,759,783 - Lee , et al. July 20, 2 | 2010-07-20 |
Semiconductor Package System With Thermal Die Bonding
App 20100176503 - Lee; Sangkwon ; et al. | 2010-07-15 |
Integrated Circuit Package System And Method Of Manufacture Thereof
App 20100171228 - Jeon; Hyung Jun ; et al. | 2010-07-08 |
Semiconductor package system with thermal die bonding
Grant 7,714,451 - Lee , et al. May 11, 2 | 2010-05-11 |
Integrated circuit package system
Grant 7,705,475 - Jeon , et al. April 27, 2 | 2010-04-27 |
Integrated circuit package system with underfill
Grant 7,682,872 - Park , et al. March 23, 2 | 2010-03-23 |
Integrated Circuit Package System With Mold Gate
App 20100038804 - Yang; DaeWook ; et al. | 2010-02-18 |
Integrated Circuit Package System With Heat Slug
App 20090174064 - Lee; Seongmin ; et al. | 2009-07-09 |
Integrated circuit package system with heat dissipation enclosure
Grant 7,521,780 - Kim , et al. April 21, 2 | 2009-04-21 |
Integrated circuit package system with heat slug
Grant 7,517,729 - Lee , et al. April 14, 2 | 2009-04-14 |
Integrated Circuit Package System With Underfill
App 20080211111 - Park; SooMoon ; et al. | 2008-09-04 |
Stackable Integrated Circuit Package System
App 20080136005 - Lee; Hun Teak ; et al. | 2008-06-12 |
Integrated Circuit Package System Employing Thin Profile Techniques
App 20080137312 - Lee; Hun Teak ; et al. | 2008-06-12 |
Integrated Circuit Package System
App 20080029911 - Jeon; Hyung Jun ; et al. | 2008-02-07 |
Integrated circuit package system with heat sink
Grant 7,309,622 - Kim , et al. December 18, 2 | 2007-12-18 |
Semiconductor Wafer Scale Package System
App 20070164422 - Jeon; Hyung Jun ; et al. | 2007-07-19 |
Integrated Circuit Package System Using Heat Slug
App 20070108596 - Yu; Kyungsic ; et al. | 2007-05-17 |
Semiconductor Package System With Thermal Die Bonding
App 20070108590 - Lee; Sangkwon ; et al. | 2007-05-17 |
Integrated Circuit Package System With A Heat Sink
App 20070108587 - Lee; Sangkwon ; et al. | 2007-05-17 |
Integrated circuit package system with heat dissipation enclosure
App 20070108597 - Kim; Taeho ; et al. | 2007-05-17 |
Integrated Circuit Package System With Heat Sink
App 20070111397 - Kim; Minseok ; et al. | 2007-05-17 |
Integrated Circuit Package System With Heat Slug
App 20060103009 - Lee; Seongmin ; et al. | 2006-05-18 |
Matte biaxially oriented polypropylene film with improved matte property and processability
Grant 6,783,848 - Rhee , et al. August 31, 2 | 2004-08-31 |
Matte biaxially oriented polypropylene film with improved matte property and processability
App 20040048084 - Rhee, Jang-Weon ; et al. | 2004-03-11 |
Ball grid array package
Grant 6,060,778 - Jeong , et al. May 9, 2 | 2000-05-09 |
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