| Patent | Date |
|---|
Method and User Terminal of Providing Contents to User
App 20220236856 - LIM; Hee Jin ; et al. | 2022-07-28 |
Content Recommendation Method and User Terminal
App 20220198125 - CHA; Su Hyeok ; et al. | 2022-06-23 |
Method And Server For Providing Content List And Operating Method Of User Terminal
App 20220191158 - CHA; Su Hyeok ; et al. | 2022-06-16 |
Independently Driving Wheel Module And Mounting Method Thereof
App 20220153348 - LEE; Tae Heon ; et al. | 2022-05-19 |
System And Method For Controlling Vehicle
App 20220105775 - HAN; Sang Oh ; et al. | 2022-04-07 |
Multilayer clip structure attached to a chip
Grant 10,896,889 - Choi , et al. January 19, 2 | 2021-01-19 |
Antenna module and electronic device including the same
Grant 10,698,455 - Yoon , et al. | 2020-06-30 |
Composite Clip Structure And Semiconductor Package Using The Same
App 20200168576 - CHOI; Yun Hwa ; et al. | 2020-05-28 |
Antenna module and electronic device having the same
Grant 10,608,340 - Kim , et al. | 2020-03-31 |
Antenna Module And Electronic Device Including The Same
App 20190294217 - YOON; Hyo Jung ; et al. | 2019-09-26 |
Wireless communications antenna and wireless communications device using the same
Grant 10,218,061 - Lee , et al. Feb | 2019-02-26 |
Wireless Communications Antenna And Wireless Communications Device Using The Same
App 20180301794 - LEE; Tae Heon ; et al. | 2018-10-18 |
Antenna Module And Electronic Device Having The Same
App 20180287258 - KIM; Si Hyung ; et al. | 2018-10-04 |
AFS system for vehicle
Grant 9,862,405 - Park , et al. January 9, 2 | 2018-01-09 |
Method for preparing protein cage, and in situ method for preparing hydrophobic additive-supported core-shell structured polymer-protein particles
Grant 9,757,342 - Paik , et al. September 12, 2 | 2017-09-12 |
Afs System For Vehicle
App 20160272236 - PARK; Ki Sung ; et al. | 2016-09-22 |
Method for Preparing Protein Cage, and In Situ Method for Preparing Hydrophobic Additive-supported Core-shell Structured Polymer-protein Particles
App 20160120814 - Paik; Hyun Jong ; et al. | 2016-05-05 |
Method and system for designing 3D semiconductor package
Grant 8,856,714 - Hwang , et al. October 7, 2 | 2014-10-07 |
Method And System For Designing 3d Semiconductor Package
App 20140208284 - Hwang; Bo-Sun ; et al. | 2014-07-24 |
Method for providing font service on service page and system for executing the method
Grant 8,161,382 - Joung , et al. April 17, 2 | 2012-04-17 |
Method For Providing Font Service On Service Page And System For Executing The Method
App 20090100074 - Joung; Eun Ju ; et al. | 2009-04-16 |
Semiconductor Package Having Reduced Thickness
App 20080283979 - Lee; Tae Heon ; et al. | 2008-11-20 |
Semiconductor package having reduced thickness
Grant 7,321,162 - Lee , et al. January 22, 2 | 2008-01-22 |
Semiconductor package having reduced thickness
Grant 7,115,445 - Lee , et al. October 3, 2 | 2006-10-03 |
Leadframe and semiconductor package with improved solder joint strength
Grant 7,102,208 - Lee , et al. September 5, 2 | 2006-09-05 |
Semiconductor package having reduced thickness
App 20040150086 - Lee, Tae Heon ; et al. | 2004-08-05 |
Semiconductor package having reduced thickness
Grant 6,696,747 - Lee , et al. February 24, 2 | 2004-02-24 |
Semiconductor device having increased moisture path and increased solder joint strength
Grant 6,525,406 - Chung , et al. February 25, 2 | 2003-02-25 |
Method for making a semiconductor package having improved defect testing and increased production yield
Grant 6,475,827 - Lee , et al. November 5, 2 | 2002-11-05 |
| 