LEE; Tae-Gon

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Tae-Gon.The latest application filed is for "circuit board and method of manufacturing the same".

Company Profile

0.7.12

LEE; Tae-Gon - Daejeon KR
LEE; Tae Gon - Daejeon-si KR
Lee; Tae-Gon - Kyunggi-do KR
Lee; Tae-Gon - Seo-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit Board And Method Of Manufacturing The Same App 20160338211 - HA; Sang-Won ; et al.	2016-11-17
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate App 20160212856 - KIM; Hong Won ; et al.	2016-07-21
Electronic Component-embedded Substrate And Manufacturing Method Thereof App 20150085455 - KIM; Hong Won ; et al.	2015-03-26
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate App 20150049445 - KIM; Hong Won ; et al.	2015-02-19
Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad Grant 8,236,690 - Yoon , et al. August 7, 2	2012-08-07
Printed circuit board for package and manufacturing method thereof Grant 8,106,308 - Jeon , et al. January 31, 2	2012-01-31
Printed circuit board and manufacturing method thereof Grant 8,084,696 - Kim , et al. December 27, 2	2011-12-27
Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad App 20100261348 - Yoon; Kyoung Ro ; et al.	2010-10-14
Method for manufacturing the BGA package board Grant 7,802,361 - Yoon , et al. September 28, 2	2010-09-28
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same Grant 7,768,116 - Yoon , et al. August 3, 2	2010-08-03
Printed Circuit Board And Manufacturing Method Thereof App 20100122842 - KIM; Tae-Gui ; et al.	2010-05-20
Printed circuit board App 20090133902 - Kim; Chin-Kwan ; et al.	2009-05-28
Method For Manufacturing The Bga Package Board App 20080216314 - Yoon; Kyoung-Ro ; et al.	2008-09-11
BGA package with concave shaped bonding pads Grant 7,414,317 - Lee , et al. August 19, 2	2008-08-19
BGA package board and method for manufacturing the same Grant 7,408,261 - Yoon , et al. August 5, 2	2008-08-05
Printed circuit board for package and manufacturing method thereof App 20080066954 - Jeon; Hyung-Jin ; et al.	2008-03-20
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same App 20070069360 - Yoon; Kyoung Ro ; et al.	2007-03-29
BGA package board and method for manufacturing the same App 20060017151 - Yoon; Kyoung-Ro ; et al.	2006-01-26
BGA package and manufacturing method App 20060006536 - Lee; Hyo Soo ; et al.	2006-01-12

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