LEE; Sung Gue

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Sung Gue.The latest application filed is for "solar cell and a method for manufacturing a solar cell".

Company Profile

1.20.19

LEE; Sung Gue - Yongin-si KR
Lee; Sung Gue - Gyeonggi-do KR
Lee; Sung Gue - Gumi-si N/A KR
Lee; Sung Gue - Gyeongsangbuk-do KR
Lee; Sung Gue - Osan KR
Lee; Sung Gue - Gyunggi-do KR
Lee; Sung Gue - Kyeongki-Do KR
Lee, Sung-Gue - Hwaseong-Gun KR
Lee, Sung-Gue - Hwaseong KR
Lee; Sung-Gue - Pyungtaek KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solar Cell And A Method For Manufacturing A Solar Cell App 20190371949 - AHN; Hyeon Woo ; et al.	2019-12-05
Solar cell using printed circuit board Grant 9,666,733 - Ahn , et al. May 30, 2	2017-05-30
Solar Cell Using Printed Circuit Board App 20150059843 - AHN; Hyeon Woo ; et al.	2015-03-05
Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board Grant 8,426,739 - Lee , et al. April 23, 2	2013-04-23
Printed Circuit Board and Method for Manufacturing the Same, and Panel for Manufacturing the Printed Circuit Board App 20110036618 - Lee; Kwang Tae ; et al.	2011-02-17
Hole plugging method for printed circuit boards, and hole plugging device Grant 7,337,535 - Lee , et al. March 4, 2	2008-03-04
Method for interconnecting multi-layer printed circuit board Grant 7,320,173 - Lee , et al. January 22, 2	2008-01-22
Bonding pads for a printed circuit board Grant 7,304,249 - Lee , et al. December 4, 2	2007-12-04
Method for forming bonding pads Grant 7,257,891 - Lee , et al. August 21, 2	2007-08-21
Method for manufacturing printed circuit board Grant 7,208,341 - Lee , et al. April 24, 2	2007-04-24
Multi-layer printed circuit board and fabricating method thereof Grant 7,189,302 - Hwang , et al. March 13, 2	2007-03-13
Printed circuit board with a heat dissipation element and package comprising the printed circuit board Grant 7,098,533 - Lee , et al. August 29, 2	2006-08-29
Method for fabricating semiconductor package and semiconductor package Grant 7,049,178 - Kim , et al. May 23, 2	2006-05-23
Method for plugging holes in a printed circuit board Grant 6,954,985 - Lee , et al. October 18, 2	2005-10-18
Multi-layer printed circuit board and fabricating method thereof App 20050098347 - Hwang, Jung-Ho ; et al.	2005-05-12
Method for manufacturing a printed circuit board Grant 6,851,184 - Lee , et al. February 8, 2	2005-02-08
Printed circuit board with a heat dissipation element and package comprising the printed circuit board App 20050023030 - Lee, Sung Gue ; et al.	2005-02-03
Method for fabricating circuit pattern of printed circuit board Grant 6,849,294 - Lee February 1, 2	2005-02-01
Method for manufacturing printed circuit board App 20040241904 - Lee, Kwang-Tae ; et al.	2004-12-02
Method for forming bonding pads App 20040200726 - Lee, Sung-Gue ; et al.	2004-10-14
Bonding pads for a printed circuit board App 20040200638 - Lee, Sung-Gue ; et al.	2004-10-14
Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board Grant 6,803,257 - Lee , et al. October 12, 2	2004-10-12
Hole plugging method for printed circuit boards, and hole plugging device App 20040154166 - Lee, Sung Gue ; et al.	2004-08-12
Method for interconnecting multi-layer printed circuit board App 20040154162 - Lee, Sung-Gue ; et al.	2004-08-12
Method for fabricating semiconductor package and semiconductor package App 20040135246 - Kim, Yong Il ; et al.	2004-07-15
Method for forming bonding pads Grant 6,740,352 - Lee , et al. May 25, 2	2004-05-25
Plating method for PCB App 20040050708 - Yang, Yu-Seock ; et al.	2004-03-18
Method for fabricating semiconductor package and semiconductor package Grant 6,706,564 - Kim , et al. March 16, 2	2004-03-16
Method for fabricating circuit pattern of printed circuit board App 20040001914 - Lee, Sung-Gue	2004-01-01
Method for forming exposed portion of circuit pattern in printed circuit board Grant 6,641,983 - Lee , et al. November 4, 2	2003-11-04
Method for fabricating semiconductor package and semiconductor package App 20030113955 - Kim, Yong Il ; et al.	2003-06-19
Bonding pad(s) for a printed circuit board and a method for forming bonding pad(s) App 20030089521 - Lee, Sung-Gue ; et al.	2003-05-15
Method for manufacturing a printed circuit board App 20030014863 - Lee, Sung Gue ; et al.	2003-01-23
Printed circuit board with a heat dissipation element, mehtod for manufacturing the printed circuit board, and package comprising the printed circuit board App 20030015348 - Lee, Sung Gue ; et al.	2003-01-23
Chip mounting structure having adhesive conductor Grant 6,509,634 - Lee , et al. January 21, 2	2003-01-21
Hole plugging method for printed circuit boards, and hole plugging device App 20020184757 - Lee, Sung Gue ; et al.	2002-12-12

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