loadpatents
name:-0.011028051376343
name:-0.005511999130249
name:-0.0078809261322021
Lee; Sukwon Patent Filings

Lee; Sukwon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Sukwon.The latest application filed is for "bonding head, die bonding apparatus including the same and method of manufacturing semiconductor package using the same".

Company Profile
7.5.9
  • Lee; Sukwon - Icheon-si KR
  • LEE; Sukwon - Yongin-si KR
  • LEE; Sukwon - Icheon-si Gyeonggi-do KR
  • Lee; Sukwon - Seoul KR
  • Lee; Sukwon - Gyeonggi-do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor packages including die over-shift indicating patterns
Grant 11,239,177 - Lee , et al. February 1, 2
2022-02-01
Bonding Head, Die Bonding Apparatus Including The Same And Method Of Manufacturing Semiconductor Package Using The Same
App 20210098415 - LEE; Jonggu ;   et al.
2021-04-01
Semiconductor Chip Bonding Apparatus Including Head Having Thermally Conductive Materials
App 20210069811 - CHOI; Sebin ;   et al.
2021-03-11
Semiconductor Packages Including Die Over-shift Indicating Patterns
App 20200286838 - LEE; Sukwon ;   et al.
2020-09-10
Semiconductor packages including die over-shift indicating patterns
Grant 10,692,816 - Lee , et al.
2020-06-23
Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance
Grant 10,312,196 - Lee , et al.
2019-06-04
Semiconductor Packages Including Die Over-shift Indicating Patterns
App 20190139900 - LEE; Sukwon ;   et al.
2019-05-09
Semiconductor Packages Including Indicators For Evaluating A Distance And Methods Of Calculating The Distance
App 20190019761 - LEE; Sukwon ;   et al.
2019-01-17
Bonding apparatus and substrate manufacturing equipment including the same
Grant 9,553,069 - Han , et al. January 24, 2
2017-01-24
Bonding Apparatus And Substrate Manufacturing Equipment Including The Same
App 20160118362 - HAN; ILYOUNG ;   et al.
2016-04-28
Pharmaceutical composition containing GLUR2-lacking AMPAR antagonist for preventing or treating psychiatric illnesses
Grant 8,835,503 - Choi , et al. September 16, 2
2014-09-16
Pharmaceutical Composition Containing Glur2-lacking Ampar Antagonist For Preventing Or Treating Psychiatric Illnesses
App 20130046023 - CHOI; Sukwoo ;   et al.
2013-02-21
Method For Manufacturing Multilayer Circuit Board
App 20120174394 - CHANG; Tae-Eun ;   et al.
2012-07-12
Pharmaceutical Composition Containing Glur2-lacking Ampar Antagonist For Preventing Or Treating Psychiatric Illnesses
App 20110105622 - Choi; Sukwoo ;   et al.
2011-05-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed