Lee; Soo Won

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Soo Won.The latest application filed is for "method and server for extracting topic and evaluating suitability of the extracted topic".

Company Profile

2.10.11

Lee; Soo Won - Seoul KR
Lee; Soo Won - Yongin-si KR
Lee; Soo Won - Gyoung Ki-Do KR
Lee; Soo Won - Nam-si N/A KR
Lee; Soo Won - AnYang-Si KR
LEE, SOO-WON - CHOONGCHEONGNAM-DO KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Method and server for extracting topic and evaluating suitability of the extracted topic Grant 10,394,864 - Lee , et al. A	2019-08-27
Stock fluctuation prediction method and server Grant 10,185,996 - Lee , et al. Ja	2019-01-22
Integrated circuit packaging system with substrate and method of manufacture thereof Grant 10,109,587 - Cuong , et al. October 23, 2	2018-10-23
Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent traces Grant 9,799,621 - Lee , et al. October 24, 2	2017-10-24
Method And Server For Extracting Topic And Evaluating Suitability Of The Extracted Topic App 20170060997 - LEE; Soo Won ; et al.	2017-03-02
Method For Predicting Personality Trait And Device Therefor App 20170032270 - LEE; Soo-Won ; et al.	2017-02-02
Stock Fluctuatiion Prediction Method And Server App 20170018033 - LEE; Soo Won ; et al.	2017-01-19
Apparatus and method for predicting the pleasantness-unpleasantness index of words using relative emotion similarity Grant 9,384,189 - Lee , et al. July 5, 2	2016-07-05
Apparatus And Method For Predicting The Pleasantness-unpleasantness Index Of Words Using Relative Emotion Similarity App 20160062989 - Lee; Soo Won ; et al.	2016-03-03
Composition for cutting wheel and cutting wheel by using the same Grant 8,956,429 - Lee , et al. February 17, 2	2015-02-17
Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces App 20140327135 - Lee; Soo Won ; et al.	2014-11-06
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,709,932 - Lee , et al. April 29, 2	2014-04-29
Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces App 20130249076 - Lee; Soo Won ; et al.	2013-09-26
Composition For Cutting Wheel And Cutting Wheel By Using The Same App 20120149289 - Lee; Doo-Hyun ; et al.	2012-06-14
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120146230 - Lee; Soo Won ; et al.	2012-06-14
Integrated circuit packaging system with base structure device Grant 7,915,724 - Ha , et al. March 29, 2	2011-03-29
Integrated Circuit Packaging System With Base Structure Device App 20090085178 - Ha; Jong-Woo ; et al.	2009-04-02
Variable Time Etching System According To The Accumulated Number Of Devices Being Processed And A Method For Etching In The Same Manner App 20020088774 - LIM, JUNG-TAEK ; et al.	2002-07-11

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