| Patent | Date |
|---|
Interconnections having double capping layer and method for forming the same
Grant 7,951,712 - Lee , et al. May 31, 2 | 2011-05-31 |
Interconnections Having Double Capping Layer and Method for Forming the Same
App 20100003814 - Lee; Kyoung-woo ; et al. | 2010-01-07 |
Interconnections having double capping layer and method for forming the same
Grant 7,605,472 - Lee , et al. October 20, 2 | 2009-10-20 |
Integrated circuit capacitor structure
Grant 7,560,332 - Lee , et al. July 14, 2 | 2009-07-14 |
Structure of a CMOS image sensor and method for fabricating the same
Grant 7,462,507 - Lee , et al. December 9, 2 | 2008-12-09 |
Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method
Grant 7,446,033 - Lee , et al. November 4, 2 | 2008-11-04 |
Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating
Grant 7,399,700 - Lee , et al. July 15, 2 | 2008-07-15 |
Structure of a CMOS image sensor and method for fabricating the same
Grant 7,400,003 - Lee , et al. July 15, 2 | 2008-07-15 |
Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating
App 20070298580 - Lee; Kyoung-woo ; et al. | 2007-12-27 |
Dual damascene interconnection with metal-insulator-metal-capacitor and method of fabricating the same
Grant 7,279,733 - Lee , et al. October 9, 2 | 2007-10-09 |
Integrated Circuit Capacitor Structure
App 20070184610 - Lee; Kyoung-woo ; et al. | 2007-08-09 |
Interconnections having double capping layer and method for forming the same
App 20070138642 - Lee; Kyoung-woo ; et al. | 2007-06-21 |
Integrated circuit capacitor structure
Grant 7,229,875 - Lee , et al. June 12, 2 | 2007-06-12 |
Interconnections having double capping layer and method for forming the same
Grant 7,205,666 - Lee , et al. April 17, 2 | 2007-04-17 |
Methods of fabricating damascene interconnection line in semiconductor devices and semiconductor devices fabricated using such methods
App 20070059923 - Lee; Hyo-jong ; et al. | 2007-03-15 |
Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler
Grant 7,183,195 - Lee , et al. February 27, 2 | 2007-02-27 |
Selective copper alloy interconnections in semiconductor devices and methods of forming the same
App 20060289999 - Lee; Hyo-Jong ; et al. | 2006-12-28 |
Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method
App 20060177630 - Lee; Sun-jung ; et al. | 2006-08-10 |
Interconnections having double capping layer and method for forming the same
App 20060163736 - Lee; Kyoung-woo ; et al. | 2006-07-27 |
Method for fabricating interconnection line in semiconductor device
App 20060154465 - Suh; Bong-seok ; et al. | 2006-07-13 |
Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process
Grant 7,041,592 - Kim , et al. May 9, 2 | 2006-05-09 |
Interconnections having double capping layer and method for forming the same
Grant 7,037,835 - Lee , et al. May 2, 2 | 2006-05-02 |
Method of forming dual damascene interconnection using low-k dielectric material
Grant 7,022,600 - Kim , et al. April 4, 2 | 2006-04-04 |
Void-free metal interconnection structure and method of forming the same
Grant 6,953,745 - Ahn , et al. October 11, 2 | 2005-10-11 |
Method of fabricating semiconductor devices having low dielectric interlayer insulation layer
Grant 6,936,533 - Kim , et al. August 30, 2 | 2005-08-30 |
Structure of a CMOS image sensor and method for fabricating the same
App 20050088551 - Lee, Soo-Geun ; et al. | 2005-04-28 |
Structure of a CMOS image sensor and method for fabricating the same
Grant 6,861,686 - Lee , et al. March 1, 2 | 2005-03-01 |
Method for forming metal wiring layer of semiconductor device
Grant 6,861,347 - Lee , et al. March 1, 2 | 2005-03-01 |
Method for forming a dual damascene wiring pattern in a semiconductor device
Grant 6,855,629 - Kim , et al. February 15, 2 | 2005-02-15 |
Void-free metal interconnection steucture and method of forming the same
App 20050029010 - Ahn, Jeong-hoon ; et al. | 2005-02-10 |
Inter-metal dielectric patterns and method of forming the same
Grant 6,849,536 - Lee , et al. February 1, 2 | 2005-02-01 |
Method of manufacturing interconnection line in semiconductor device
Grant 6,828,229 - Lee , et al. December 7, 2 | 2004-12-07 |
Method for forming metal wiring layer of semiconductor device
Grant 6,815,331 - Lee , et al. November 9, 2 | 2004-11-09 |
Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating the same
App 20040197991 - Lee, Kyoung-woo ; et al. | 2004-10-07 |
Structure of a CMOS image sensor and method for fabricating the same
App 20040140564 - Lee, Soo-Geun ; et al. | 2004-07-22 |
Integrated circuit capacitor structure
App 20040137694 - Lee, Kyoung-Woo ; et al. | 2004-07-15 |
Interconnections having double capping layer and method for forming the same
App 20040135261 - Lee, Kyoung-woo ; et al. | 2004-07-15 |
Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler
App 20040132291 - Lee, Kyoung-woo ; et al. | 2004-07-08 |
Method of forming dual damascene interconnection using low-k dielectric material
App 20040067634 - Kim, Jae-Hak ; et al. | 2004-04-08 |
Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process
App 20040038521 - Kim, Jae-hak ; et al. | 2004-02-26 |
Method of patterning inter-metal dielectric layers
App 20040029386 - Lee, Kwang Hee ; et al. | 2004-02-12 |
Method for forming a dual damascene wiring pattern in a semiconductor device
App 20040018721 - Kim, Jae-Hak ; et al. | 2004-01-29 |
Inter-metal dielectric patterns and method of forming the same
App 20030186538 - Lee, Soo-Geun ; et al. | 2003-10-02 |
Method for forming metal wiring layer of semiconductor device
App 20030176056 - Lee, Kyoung-Woo ; et al. | 2003-09-18 |
Method for forming metal wiring layer of semiconductor device
App 20020173143 - Lee, Kyoung-woo ; et al. | 2002-11-21 |
Method of manufacturing interconnection line in semiconductor device
App 20020168849 - Lee, Soo-geun ; et al. | 2002-11-14 |
Method of fabricating semiconductor devices having low dielectric interlayer insulation layer
App 20020106891 - Kim, Jae-Hak ; et al. | 2002-08-08 |
Method for forming an interconnection line using a hydrosilsesquioxane (HSQ) layer as an interlayer insulating layer
App 20020033486 - Kim, Won-Jin ; et al. | 2002-03-21 |
Method of forming self-aligned silicide in semiconductor device
Grant 6,329,276 - Ku , et al. December 11, 2 | 2001-12-11 |
Method of fabricating copper interconnecting line
App 20010018273 - Park, Ji-Soon ; et al. | 2001-08-30 |
Method of filling gap by use of high density plasma oxide film and deposition apparatus therefor
App 20010005630 - Kim, Sun-Rae ; et al. | 2001-06-28 |
Hydrogen-storage material employing ti-mn alloy system
Grant 5,888,317 - Lee , et al. March 30, 1 | 1999-03-30 |
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