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name:-0.0076718330383301
name:-0.0057408809661865
name:-0.0036740303039551
Lee; Soo Bong Patent Filings

Lee; Soo Bong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Soo Bong.The latest application filed is for "intermediate connection system for ultra-high-voltage direct current power cable".

Company Profile
3.6.7
  • Lee; Soo Bong - Gyeonggi-do KR
  • Lee; Soo Bong - Gyeongsangbuk-do KR
  • LEE; Soo Bong - Chilgok-gun Gyeongsangbuk-do
  • Lee; Soo Bong - Yongin-si KR
  • LEE; Soo-bong - Changwon-city KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cartridge-type X-ray source apparatus and X-ray emission apparatus using same
Grant 11,039,525 - Kim , et al. June 15, 2
2021-06-15
Intermediate connection system for ultra-high-voltage direct current power cable
Grant 10,749,277 - Lee , et al. A
2020-08-18
Intermediate Connection System For Ultra-high-voltage Direct Current Power Cable
App 20200203855 - LEE; Soo Bong ;   et al.
2020-06-25
Ventilation apparatus of lamp module for vehicles
Grant 9,879,841 - Lee January 30, 2
2018-01-30
Ventilation apparatus of lamp module for vehicles
Grant 9,810,395 - Lee November 7, 2
2017-11-07
Cartridge-type X-ray Source Apparatus And X-ray Emission Apparatus Using Same
App 20170111984 - KIM; Tae Woo ;   et al.
2017-04-20
Ventilation Apparatus Of Lamp Module For Vehicles
App 20170102119 - LEE; Soo Bong
2017-04-13
Ventilation Apparatus Of Lamp Module For Vehicles
App 20170102121 - LEE; Soo Bong
2017-04-13
Camera Module
App 20100328525 - LEE; Soo-bong ;   et al.
2010-12-30
Lead frame and semiconductor device having the lead frame
Grant 7,541,664 - Lee , et al. June 2, 2
2009-06-02
Semiconductor lead frame, semiconductor package having the same, and method of plating the same
Grant 7,501,692 - Choi , et al. March 10, 2
2009-03-10
Semiconductor lead frame, semiconductor package having the same, and method of plating the same
App 20060071310 - Choi; Woo-suk ;   et al.
2006-04-06
Lead frame and method of manufacturing the same
App 20060049493 - Lee; Soo-bong ;   et al.
2006-03-09

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