loadpatents
Patent applications and USPTO patent grants for Lee; Song-Bor.The latest application filed is for "spacer structures for semiconductor devices".
Patent | Date |
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Package component with stepped passivation layer Grant 11,450,567 - Cheng , et al. September 20, 2 | 2022-09-20 |
Core-shell Nanostructures For Semiconductor Devices App 20220149155 - PENG; Cheng-Yi ;   et al. | 2022-05-12 |
Spacer Structures for Semiconductor Devices App 20220149178 - PENG; CHENG-YI ;   et al. | 2022-05-12 |
Spacer structures for semiconductor devices Grant 11,233,149 - Peng , et al. January 25, 2 | 2022-01-25 |
Core-shell nanostructures for semiconductor devices Grant 11,233,119 - Peng , et al. January 25, 2 | 2022-01-25 |
Package Component with Stepped Passivation Layer App 20210375675 - Cheng; Ming-Da ;   et al. | 2021-12-02 |
Semiconductor Device And Manufacturing Method Thereof App 20210359085 - PENG; Cheng-Yi ;   et al. | 2021-11-18 |
Method Of Manufacturing Semiconductor Devices And Semiconductor Devices App 20210351282 - PENG; Cheng-Yi ;   et al. | 2021-11-11 |
Spacer Structures for Semiconductor Devices App 20210280716 - PENG; Cheng-Yi ;   et al. | 2021-09-09 |
Passivation Layers For Semiconductor Devices App 20210280486 - PENG; Cheng-Yi ;   et al. | 2021-09-09 |
Core-shell Nanostructures For Semiconductor Devices App 20210273050 - PENG; Cheng-Yi ;   et al. | 2021-09-02 |
Method of manufacturing a semiconductor device and a semiconductor device Grant 11,101,360 - Peng , et al. August 24, 2 | 2021-08-24 |
Semiconductor device and manufacturing method thereof Grant 11,075,269 - Peng , et al. July 27, 2 | 2021-07-27 |
Method of manufacturing semiconductor devices and semiconductor devices Grant 11,069,791 - Peng , et al. July 20, 2 | 2021-07-20 |
Semiconductor Device And Manufacturing Method Thereof App 20200176566 - PENG; Cheng-Yi ;   et al. | 2020-06-04 |
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device App 20200168716 - PENG; Cheng-Yi ;   et al. | 2020-05-28 |
Method Of Manufacturing Semiconductor Devices And Semiconductor Devices App 20200135891 - PENG; Cheng-Yi ;   et al. | 2020-04-30 |
Integrated circuit having thinner gate dielectric and method of making Grant 9,666,483 - Lu , et al. May 30, 2 | 2017-05-30 |
Wafer back side processing structure and apparatus Grant 9,443,721 - Li , et al. September 13, 2 | 2016-09-13 |
Semiconductor structure and method for forming the same Grant 9,406,559 - Yang , et al. August 2, 2 | 2016-08-02 |
Semiconductor Structure And Method For Forming The Same App 20160005650 - YANG; Han-Wei ;   et al. | 2016-01-07 |
Wafer Back Side Processing Structure and Apparatus App 20150357186 - Li; Cheng-Chien ;   et al. | 2015-12-10 |
Wafer back side processing structure and apparatus Grant 9,123,673 - Li , et al. September 1, 2 | 2015-09-01 |
Apparatus and method for designing an integrated circuit layout having a plurality of cell technologies Grant 9,122,828 - Chiang , et al. September 1, 2 | 2015-09-01 |
Method and system for enhanced integrated circuit layout Grant 9,009,639 - Hung , et al. April 14, 2 | 2015-04-14 |
Method And System For Enhanced Integrated Circuit Layout App 20150020041 - HUNG; Wei-Chiang ;   et al. | 2015-01-15 |
Apparatus And Method For Designing An Integrated Circuit Layout Having A Plurality Of Cell Technologies App 20140344770 - CHIANG; Tsung-Yu ;   et al. | 2014-11-20 |
Guard ring for through vias Grant 8,890,293 - Lu , et al. November 18, 2 | 2014-11-18 |
Wafer Back Side Processing Structure and Apparatus App 20140273508 - Li; Cheng-Chien ;   et al. | 2014-09-18 |
Integrated Circuit Having Thinner Gate Dielectric And Method Of Making App 20130207200 - LU; Chih-Hung ;   et al. | 2013-08-15 |
Guard Ring for Through Vias App 20130154048 - Lu; Chih-Hung ;   et al. | 2013-06-20 |
Method of forming through-silicon vias Grant 7,825,024 - Lin , et al. November 2, 2 | 2010-11-02 |
Method of Forming Through-Silicon Vias App 20100130003 - Lin; Chuan-Yi ;   et al. | 2010-05-27 |
Systems and methods for inspection control App 20060178767 - Lee; Song-Bor ;   et al. | 2006-08-10 |
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