Lee; Shen-Nan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Shen-Nan.The latest application filed is for "chemical mechanical polishing slurry composition and method of polishing metal layer".

Company Profile

34.39.47

Lee; Shen-Nan - Hsinchu County TW
Lee; Shen-Nan - Hsinchu TW
Lee; Shen-Nan - Jhudong Township TW
Lee; Shen-Nan - Hsinchu City TW
- Hsinchu County TW
Lee; Shen-Nan - Jhudong N/A TW
Lee; Shen-Nan - Judung Jen TW
Lee, Shen-Nan - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for conditioning polishing pad Grant 11,389,928 - Lee , et al. July 19, 2	2022-07-19
Chemical Mechanical Polishing Slurry Composition And Method Of Polishing Metal Layer App 20220195246 - Liao; Chun-Hung ; et al.	2022-06-23
CMP slurry solution for hardened fluid material Grant 11,312,882 - Lin , et al. April 26, 2	2022-04-26
Chemical mechanical polishing slurry composition and method of polishing metal layer Grant 11,267,987 - Liao , et al. March 8, 2	2022-03-08
Method for forming multi-layer mask Grant 11,120,995 - Hsu , et al. September 14, 2	2021-09-14
Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof App 20210257302 - Tsai; Tsung-Ling ; et al.	2021-08-19
Materials and Methods for Chemical Mechanical Polishing of Ruthenium-Containing Materials App 20210171800 - Lee; An-Hsuan ; et al.	2021-06-10
Method for manufacturing a FinFET device Grant 11,031,391 - Lee , et al. June 8, 2	2021-06-08
CMP-friendly coatings for planar recessing or removing of variable-height layers Grant 11,011,385 - Liu , et al. May 18, 2	2021-05-18
Partial barrier free vias for cobalt-based interconnects and methods of fabrication thereof Grant 11,004,794 - Tsai , et al. May 11, 2	2021-05-11
Mechanism for manufacturing semiconductor device Grant 11,004,691 - Wu , et al. May 11, 2	2021-05-11
Chemical Mechanical Polishing Slurry Composition And Method Of Polishing Metal Layer App 20210130650 - Liao; Chun-Hung ; et al.	2021-05-06
Contact Plugs For Semiconductor Device And Method Of Forming Same App 20210104431 - Khaderbad; Mrunal A. ; et al.	2021-04-08
Semiconductor Structure And Method Of Manufacturing The Same App 20210098283 - LEE; Shen-Nan ; et al.	2021-04-01
Slurry Compositions For Chemical Mechanical Planarization App 20210098266 - Lee; An-Hsuan ; et al.	2021-04-01
Wafer polishing with separated chemical reaction and mechanical polishing Grant 10,964,549 - Lee , et al. March 30, 2	2021-03-30
Materials and methods for chemical mechanical polishing of ruthenium-containing materials Grant 10,920,105 - Lee , et al. February 16, 2	2021-02-16
CMP Slurry Solution for Hardened Fluid Material App 20200407594 - Lin; Kuo-Yin ; et al.	2020-12-31
Ruthenium-containing semiconductor structure and method of manufacturing the same Grant 10,847,410 - Lee , et al. November 24, 2	2020-11-24
Method of forming contact plugs for semiconductor device Grant 10,847,413 - Khaderbad , et al. November 24, 2	2020-11-24
Slurry App 20200357653 - LIAO; CHUN-HUNG ; et al.	2020-11-12
Post Cmp Cleaning Apparatus And Post Cmp Cleaning Methods App 20200294821 - WU; Chen-Hao ; et al.	2020-09-17
CMP slurry solution for hardened fluid material Grant 10,774,241 - Lin , et al. Sept	2020-09-15
Slurry and manufacturing semiconductor using the slurry Grant 10,727,076 - Liao , et al.	2020-07-28
Wafer Polishing With Separated Chemical Reaction And Mechanical Polishing App 20200176264 - LEE; Shen-Nan ; et al.	2020-06-04
Slurry And Manufacturing Semiconductor Using The Slurry App 20200135486 - LIAO; CHUN-HUNG ; et al.	2020-04-30
Mechanism For Manufacturing Semiconductor Device App 20200118833 - WU; Chen-Hao ; et al.	2020-04-16
Method For Forming Multi-layer Mask App 20200105538 - HSU; Chung-Wei ; et al.	2020-04-02
Semiconductor Structure And Method Of Manufacturing The Same App 20200090983 - LEE; Shen-Nan ; et al.	2020-03-19
Method For Manufacturing A Finfet Device App 20200035677A1 -	2020-01-30
Materials and Methods for Chemical Mechanical Polishing of Ruthenium-Containing Materials App 20200032105 - Lee; An-Hsuan ; et al.	2020-01-30
Fabrication of a Polishing Pad for Chemical Mechanical Polishing App 20200030934 - Lee; An-Hsuan ; et al.	2020-01-30
Partial Barrier Free Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof App 20200006230 - Tsai; Tsung-Ling ; et al.	2020-01-02
Mechanism for manufacturing semiconductor device Grant 10,510,555 - Wu , et al. Dec	2019-12-17
Method for forming multi-layer mask Grant 10,497,574 - Hsu , et al. De	2019-12-03
Method for manufacturing a FinFET device Grant 10,461,080 - Lee , et al. Oc	2019-10-29
Contact Plugs for Semiconductor Device and Method of Forming Same App 20190164817 - Khaderbad; Mrunal A ; et al.	2019-05-30
Method For Manufacturing A Finfet Device App 20190164963 - LEE; Shen-Nan ; et al.	2019-05-30
Method For Conditioning Polishing Pad App 20190160628 - LEE; Shen-Nan ; et al.	2019-05-30
CMP Polishing Head Design for Improving Removal Rate Uniformity App 20190126429 - Hou; Te-Chien ; et al.	2019-05-02
Method of manufacturing semiconductor device Grant 10,269,579 - Lee , et al.	2019-04-23
Mechanism For Manufacturing Semiconductor Device App 20190103283 - WU; Chen-Hao ; et al.	2019-04-04
Method For Forming Multi-layer Mask App 20190096686 - HSU; Chung-Wei ; et al.	2019-03-28
CMP polishing head design for improving removal rate uniformity Grant 10,160,091 - Hou , et al. Dec	2018-12-25
Polisher, polishing tool, and polishing method Grant 10,144,109 - Tsai , et al. De	2018-12-04
Systems and methods for performing chemical mechanical planarization Grant 9,962,801 - Lee , et al. May 8, 2	2018-05-08
Wafer back-side polishing system and method for integrated circuit device manufacturing processes Grant 9,852,899 - Lee , et al. December 26, 2	2017-12-26
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers App 20170352548 - Liu; Wen-Kuei ; et al.	2017-12-07
CMP-friendly coatings for planar recessing or removing of variable-height layers Grant 9,748,109 - Liu , et al. August 29, 2	2017-08-29
Polisher, Polishing Tool, And Polishing Method App 20170190017 - TSAI; Teng-Chun ; et al.	2017-07-06
CMP Slurry Solution for Hardened Fluid Material App 20170158914 - Lin; Kuo-Yin ; et al.	2017-06-08
CMP Polishing Head Design for Improving Removal Rate Uniformity App 20170136602 - Hou; Te-Chien ; et al.	2017-05-18
Wafer Back-side Polishing System And Method For Integrated Circuit Device Manufacturing Processes App 20170125237 - Lee; Shen-Nan ; et al.	2017-05-04
CMP slurry solution for hardened fluid material Grant 9,567,493 - Lin , et al. February 14, 2	2017-02-14
Wafer back-side polishing system and method for integrated circuit device manufacturing processes Grant 9,559,021 - Lee , et al. January 31, 2	2017-01-31
BARC-assisted process for planar recessing or removing of variable-height layers Grant 9,478,431 - Liu , et al. October 25, 2	2016-10-25
Wafer Back-side Polishing System And Method For Integrated Circuit Device Manufacturing Processes App 20160190023 - Lee; Shen-Nan ; et al.	2016-06-30
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers App 20160172209 - Liu; Wen-Kuei ; et al.	2016-06-16
Barc-assisted Process For Planar Recessing Or Removing Of Variable-height Layers App 20160099157 - Liu; Wen-Kuei ; et al.	2016-04-07
Wafer back-side polishing system and method for integrated circuit device manufacturing processes Grant 9,287,127 - Lee , et al. March 15, 2	2016-03-15
Barc-assisted process for planar recessing or removing of variable-height layers Grant 9,236,446 - Liu , et al. January 12, 2	2016-01-12
Cmp Slurry Solution For Hardened Fluid Material App 20150307747 - Lin; Kuo-Yin ; et al.	2015-10-29
Barc-assisted Process For Planar Recessing Or Removing Of Variable-height Layers App 20150263132 - Liu; Wen-Kuei ; et al.	2015-09-17
Chemical mechanical polish process control for improvement in within-wafer thickness uniformity Grant 9,132,523 - Lee , et al. September 15, 2	2015-09-15
Wafer Back-side Polishing System And Method For Integrated Circuit Device Manufacturing Processes App 20150235858 - Lee; Shen-Nan ; et al.	2015-08-20
Systems And Methods For Performing Chemical Mechanical Planarization App 20150194318 - LEE; SHEN-NAN ; et al.	2015-07-09
Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity App 20120164918 - Lee; Shen-Nan ; et al.	2012-06-28
High planarizing method for use in a gate last process Grant 8,153,526 - Lee , et al. April 10, 2	2012-04-10
Chemical mechanical polish process control for improvement in within-wafer thickness uniformity Grant 8,129,279 - Lee , et al. March 6, 2	2012-03-06
Chemical Mechanical Polish Process Control for Improvement in Within-Wafer Thickness Uniformity App 20100093259 - Lee; Shen-Nan ; et al.	2010-04-15
High Planarizing Method For Use In A Gate Last Process App 20100048007 - Lee; Shen-Nan ; et al.	2010-02-25
Metal line formation using advaced CMP slurry App 20080265416 - Lee; Shen-Nan ; et al.	2008-10-30
Polymeric particle slurry system and method to reduce feature sidewall erosion Grant 7,407,601 - Lee , et al. August 5, 2	2008-08-05
Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance Grant 6,924,238 - Chou , et al. August 2, 2	2005-08-02
Method to reduce dishing and erosion in a CMP process Grant 6,919,276 - Lee , et al. July 19, 2	2005-07-19
Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance App 20040248426 - Chou, Tzu-Jen ; et al.	2004-12-09
Polymeric particle slurry system and method for improved planarity App 20040226918 - Lee, Shen-Nan ; et al.	2004-11-18
Adhesion enhancement between CVD dielectric and spin-on low-k silicate films Grant 6,812,135 - Li , et al. November 2, 2	2004-11-02
Method to reduce dishing and erosion in a CMP process App 20040214442 - Lee, Shen-Nan ; et al.	2004-10-28
Adhesion enhancement between CVD dielectric and spin-on low-k silicate films App 20040087122 - Li, Lain-Jong ; et al.	2004-05-06
Method for achieving uniform CU CMP polishing App 20030211814 - Shih, Tsu ; et al.	2003-11-13
Bimodal Slurry System App 20030200702 - Lee, Shen-Nan ; et al.	2003-10-30
Bimodal slurry system Grant 6,638,328 - Lee , et al. October 28, 2	2003-10-28
Method of wastewater treatment by electrolysis and oxidization Grant 6,126,838 - Huang , et al. October 3, 2	2000-10-03

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