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Patent applications and USPTO patent grants for LEE; Shaw W..The latest application filed is for "methods and systems for packaging integrated circuits with thin metal contacts".
Patent | Date |
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Methods And Systems For Packaging Integrated Circuits With Thin Metal Contacts App 20100015329 - NGUYEN; Luu T. ;   et al. | 2010-01-21 |
Solder ball attachment machine for semiconductor packages Grant 5,620,927 - Lee April 15, 1 | 1997-04-15 |
Ultra thin ball grid array using a flex tape or printed wiring board substrate and method Grant 5,620,928 - Lee , et al. April 15, 1 | 1997-04-15 |
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