Lee; Shao-Chien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Shao-Chien.The latest application filed is for "circuit board structure and manufacturing method thereof".

Company Profile

3.11.19

Lee; Shao-Chien - Taipei City TW
LEE; Shao-Chien - Taoyuan City TW
Lee; Shao-Chien - Taoyuan TW
Lee; Shao-Chien - Taipei TW
Lee; Shao-Chien - Taoyuan County N/A TW
Lee; Shao-Chien - Jhongli City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit Board Structure And Manufacturing Method Thereof App 20220256717 - Lau; John Hon-Shing ; et al.	2022-08-11
Circuit Board And Manufacturing Method Thereof And Electronic Device App 20220240369 - Lu; Chih-Chiang ; et al.	2022-07-28
Circuit Board And Manufacturing Method Thereof And Electronic Device App 20220232694 - Lu; Chih-Chiang ; et al.	2022-07-21
Circuit Board And Manufacturing Method Thereof App 20220095464 - Wang; Pei-Wei ; et al.	2022-03-24
Circuit Board Structure And Manufacturing Method Thereof App 20220071010 - TSENG; Tzyy-Jang ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220071000 - Tseng; Tzyy-Jang ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220071015 - Tseng; Tzyy-Jang ; et al.	2022-03-03
Method of manufacturing circuit board structure Grant 11,114,782 - Tseng , et al. September 7, 2	2021-09-07
Circuit Board Structure And Manufacturing Method Thereof App 20210273356 - TSENG; Tzyy-Jang ; et al.	2021-09-02
Circuit board structure Grant 10,939,538 - Wu , et al. March 2, 2	2021-03-02
Circuit Board Structure And Manufacturing Method Thereof App 20200366012 - TSENG; Tzyy-Jang ; et al.	2020-11-19
Multilayer circuit board structure and manufacturing method thereof Grant 10,736,215 - Lee , et al.	2020-08-04
Structure and manufacturing method of heat dissipation substrate and package structure and method thereof Grant 10,497,847 - Liu , et al. De	2019-12-03
Structure And Manufacturing Method Of Heat Dissipation Substrate And Package Structure And Method Thereof App 20190067543 - Liu; Wen-Fang ; et al.	2019-02-28
Chip Package Circuit Board Module App 20180368263 - Liu; Wen-Fang ; et al.	2018-12-20
Chip package circuit board module Grant 10,159,151 - Liu , et al. Dec	2018-12-18
Chip package circuit board module Grant 10,056,356 - Liu , et al. August 21, 2	2018-08-21
Method for fabricating circuit board structure with concave conductive cylinders Grant 8,590,147 - Lee , et al. November 26, 2	2013-11-26
Process For Fabricating Circuit Board App 20120124830 - Cheng; David C. H. ; et al.	2012-05-24
Method of fabricating circuit board Grant 8,091,221 - Lee , et al. January 10, 2	2012-01-10
Method For Fabricating Circuit Board Structure With Concave Conductive Cylinders App 20100101083 - Lee; Shao-Chien ; et al.	2010-04-29
Circuit board and method of fabricating the same Grant 7,667,144 - Lee , et al. February 23, 2	2010-02-23
Circuit Board And Process For Fabricating The Same App 20090144972 - Cheng; David C. H. ; et al.	2009-06-11
Method Of Fabricating Circuit Board App 20090117262 - Lee; Shao-Chien ; et al.	2009-05-07
Circuit Board Structure With Concave Conductive Cylinders And Method For Fabricating The Same App 20090025210 - Lee; Shao-Chien ; et al.	2009-01-29
Circuit Board And Method Of Fabricating The Same App 20080277141 - Lee; Shao-Chien ; et al.	2008-11-13
Method for fabricating electrical interconnect structure Grant 7,393,720 - Lee , et al. July 1, 2	2008-07-01
Method For Fabricating Electrical Interconnect Structure App 20060068577 - Lee; Shao-Chien ; et al.	2006-03-30
[circuit Connecting Structure And Fabricating Method Thereof] App 20050230711 - Chang, Chin-Chung ; et al.	2005-10-20

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